Henkel

Henkel

Adhesives, Electronics Assembly, and Thermal Management Solutions

Henkel supplies industrial adhesives, sealants, electronics assembly materials, encapsulants, die attach technologies, thermal interface materials, and specialty process chemistries for applications across automotive, aerospace, electronics, semiconductor, industrial manufacturing, and other markets. Its industrial portfolio includes product families and brands such as Loctite, Bonderite, Frekote, Stycast, Eccobond, and Bergquist, with chemistry, cure method, packaging, and processing requirements varying by product and application.

As an authorized Henkel distributor, Krayden supplies a selection of Henkel industrial and electronic materials and provides technical guidance for material selection, product comparison, substrate and application requirements, dispensing, and process considerations.

Markets Served by Henkel

AerospaceAutomotiveAutomotive AftermarketBuilding & Construction ComponentsConsumer ElectronicsData & TelecommunicationsFurniture & InteriorsIndustrial Maintenance & RepairIndustrial ManufacturingMedicalMetalsPackaging & ConvertingPersonal HygienePowerSemiconductorSports & Fashion

Featured Henkel Brands

Six Henkel brands covering industrial bonding, surface treatment, mold release, electronics protection, and thermal management materials.

Loctite logo

Loctite™

Adhesives, sealants, and surface-treatment chemistries spanning structural bonding, gasketing, instant adhesives, epoxies, silicones, and electronics assembly applications.

Bonderite logo

Bonderite™

Metal pretreatment and surface technologies including industrial cleaners, conversion coatings, and related preparation chemistries for aluminum, steel, and other substrates.

Frekote logo

Frekote™

Mold release agents, sealers, and cleaners used to support composite, rubber, and other molding operations where controlled release and mold maintenance are required.

Stycast logo

Stycast™

Epoxy and silicone potting and encapsulation materials used to protect sensitive circuitry and electronic assemblies from mechanical and environmental exposure.

Eccobond logo

Eccobond™

Electronics protection and assembly materials including underfills, liquid encapsulants, optically clear materials, and other formulations used around semiconductor and electronic packages.

Bergquist logo

Bergquist™

Thermal interface materials for transferring heat between electronic components and heat sinks or enclosures, including gap pads, dispensable gap fillers, and thermal compounds.

 
Henkel adhesives and sealants application
Henkel Structural & Sealing Solutions

Adhesives & Sealants

Henkel adhesives and sealants span general-purpose and structural bonding materials alongside gasketing sealants for industrial assembly and sealing. The source portfolio includes epoxy, silicone, acrylic, anaerobic, and other product-specific chemistries. Selection depends on the substrates, cure process, required handling time, environmental exposure, joint or flange geometry, and service conditions.

Henkel industrial adhesive product
Bonding Technology

Adhesives

General-purpose and structural adhesive formulations for bonding metals, plastics, composites, and other substrates across industrial applications. Selection should account for substrate compatibility, cure method, handling time, and the required mechanical and environmental performance.

Loctite gasketing sealant product
Sealing Method

Gasketing Sealants (CIPG & FIPG)

Cured-in-place and formed-in-place gasketing sealants are dispensed directly onto flanges or housings and cure into a sealing bead or gasket. Product selection depends on substrate, flange geometry, fluid exposure, cure mechanism, and service temperature.

 
Henkel electronics encapsulation application
Henkel Electronics Protection Materials

Encapsulants & Underfills

Henkel encapsulation and underfill materials protect electronic components, interconnects, and assemblies from mechanical and environmental stresses. The source portfolio includes potting systems, liquid encapsulants, low-pressure molding materials, capillary underfills, and optically clear formulations. Selection depends on package geometry, material flow, cure method, thermal-mechanical requirements, environmental exposure, and production process.

Loctite Stycast potting material
Protection Method

Potting Materials

Liquid resin systems used to encapsulate an assembly or housing for mechanical and environmental protection. Relevant selection factors include resin chemistry, viscosity, cure profile, thermal behavior, and the required balance of rigidity, flexibility, and electrical insulation.

Loctite Eccobond liquid encapsulant
Encapsulation Type

Liquid Encapsulants

Dispensable encapsulation compounds, including glob-top materials, used to cover and protect electronic die, wire bonds, and package features. Flow behavior, cure conditions, package geometry, and thermal-mechanical requirements should be evaluated for the exact assembly.

Henkel low pressure molding material
Molding Method

Low Pressure Molding

Low-pressure molding materials encapsulate delicate electronic components at reduced molding pressure and can support short production cycles. Selection depends on formulation, processing temperature, viscosity, component geometry, substrate compatibility, and the service environment.

Loctite Eccobond underfill material
Package Protection

Underfills

Capillary-flow underfills are dispensed beneath flip-chip, BGA, and related packages to reinforce interconnects and redistribute mechanical and thermal stress. Flow, gap size, cure schedule, package materials, and rework requirements are product-specific selection factors.

Loctite Eccobond optically clear material
Optical Property

Optically Clear Materials

Optically clear and UV-curable encapsulation materials are used where electronic protection must be combined with light transmission, such as selected display, sensor, and optoelectronic applications. Optical requirements, cure method, bond-line geometry, and substrate compatibility vary by product.

 
Henkel electronics assembly application
Henkel Electronics Assembly Materials

Electronics Assembly Adhesives & Inks

Henkel electronics assembly materials include film and paste adhesive technologies used for component attachment, structural bonding, electrical interconnection, grounding, and EMI-management functions. Depending on the application, materials may be electrically conductive or insulating and may be supplied in film, paste, coating, or other product-specific formats. Selection should account for the assembly geometry, electrical function, deposition method, cure process, and production requirements.

Loctite Ablestik assembly film adhesive
Adhesive Format

Assembly Film Adhesives

Sheet-form adhesive materials used where controlled bond-line thickness, clean handling, and repeatable placement are important in electronics and component assembly. Selection should consider film thickness, substrate combination, lamination or cure process, and electrical requirements.

Loctite Ablestik electrically conductive material
Electrical Function

Electrically Conductive Adhesives

Conductive adhesive and ink technologies are used for grounding, shielding, and electrical interconnection where conductivity is required in addition to mechanical attachment. Filler system, deposition method, cure process, line geometry, and required electrical performance vary by product.

Loctite Ablestik non-conductive material
Electrical Function

Non-Conductive Adhesives

Electrically insulating adhesive materials support component and package assembly where mechanical bonding is needed without creating an electrical path. Material format, cure conditions, package geometry, dielectric requirements, and process method should be confirmed for the selected product.

 
Henkel semiconductor die attach application
Henkel Semiconductor Assembly Materials

Die Attach

Henkel die attach materials support bonding of semiconductor die to substrates, leadframes, and package structures using film, paste, sintering, and coating-based approaches. Required electrical conductivity, thermal transport, bond-line control, metallization, cure or sintering conditions, and production method vary by material and package design.

Loctite Ablestik die attach film
Material Format

Die Attach Films

Film-form die attach materials provide controlled adhesive thickness and clean handling for attaching semiconductor die to substrates or packages. Selection depends on die and substrate materials, film thickness, lamination process, cure requirements, and the required thermal or electrical function.

Loctite Ablestik die attach paste
Material Format

Die Attach Pastes

Dispensable die attach pastes are used to bond semiconductor die during package assembly and may be formulated for electrical or thermal conductivity depending on the product. Selection should consider rheology, bond-line control, cure profile, package materials, and conductivity requirements.

Loctite Ablestik die attach material
Bonding Process

Sintering & Semi-Sintering Pastes

Sintering and semi-sintering die attach materials are selected for package designs requiring high thermal transport and robust attachment under product-specific heat and pressure conditions. Process temperature, pressure, metallization, bond-line thickness, and production method must be matched to the exact material.

Loctite wafer backside coating material
Wafer Process

Wafer Backside Coatings

Conductive or adhesive coatings applied to the backside of a wafer before dicing can prepare individual die for downstream attachment or package-level functions. Selection depends on coating method, film thickness, drying or cure process, metallization, and compatibility with later die attach steps.

 
Henkel thermal management application
Henkel Thermal Management Solutions

Thermal Interface Materials

Henkel thermal interface materials support heat transfer between electronic components and heat sinks, cooling plates, or enclosures. The source portfolio includes Bergquist gap pads, dispensable one-part and two-part thermal materials, and thermal greases. Selection depends on thermal conductivity, gap thickness, compressibility or bond-line control, dielectric requirements, dispensing method, and assembly process.

Bergquist thermal gap pad
Material Form

Thermal Gap Pads

Soft, compressible interface pads fill gaps between heat-generating components and heat sinks or enclosures while accommodating surface and tolerance variation. Pad thickness, compressibility, dielectric needs, thermal conductivity, and assembly pressure are key selection variables.

Bergquist two-part thermal material
Cure Format

Two-Part Thermal Gap Fillers & Bonding Materials

Two-component dispensable thermal materials cure in place and can combine gap filling with mechanical attachment, depending on the product. Selection should account for mix and dispense method, working time, bond-line thickness, cure conditions, and required thermal performance.

Bergquist one-part thermal material
Cure Format

One-Part Dispensable Thermal Materials

Single-component dispensable thermal materials simplify application by eliminating on-line mixing while providing conformable gap filling. Product selection depends on dispense behavior, cure or set mechanism, gap stability, storage conditions, and thermal requirements.

Henkel thermal grease product image
Material Form

Thermal Greases

Non-curing thermal compounds are applied between components and heat sinks to fill microscopic surface irregularities and reduce interface resistance. Selection should account for bond-line thickness, pump-out or migration concerns, electrical properties, application method, and service environment.

 
Henkel specialty chemicals and mold maintenance application
Henkel Specialty & Mold Support Materials

Specialty Chemicals, Molding Compounds & Mold Maintenance

Henkel specialty and mold-support materials include cure components, low-pressure molding compounds, mold-cleaning materials, mold-release agents, and surface-preparation chemistries. Henkel currently offers low-pressure molding materials under TECHNOMELT and LOCTITE for electronic overmolding, while process and maintenance materials support compatible resin systems, molds, and downstream bonding or coating operations.

Loctite cure component
Process Chemistry

Additives & Cure Components

Catalysts, hardeners, and related cure components are paired with compatible resin systems to initiate or control cure. The required component, mix ratio, processing window, storage conditions, and cure schedule are specific to the companion system.

Henkel low-pressure molding compound
Molding Technology

Low-Pressure Molding Compounds

Henkel low-pressure molding materials include thermoplastic polyamide- and polyolefin-based systems used to overmold and protect electronic devices, connectors, cables, sensors, and related assemblies. Current Henkel offerings include TECHNOMELT and LOCTITE materials selected according to process temperature, viscosity, substrate compatibility, and end-use conditions.

Henkel mold cleaning material
Maintenance Function

Mold Cleaning Compounds

Mold-cleaning materials are used to remove release residue and cured resin buildup from production tooling between manufacturing runs. Selection should consider the residue type, mold surface, cleaning method, process temperature, and compatibility with the release system used afterward.

Frekote mold release product
Release Technology

Mold Release Agents

Frekote mold release materials are applied to tooling surfaces to reduce sticking and support consistent part release in composite, rubber, and other molding operations. Selection depends on mold material, molded resin or elastomer, release durability, application method, and cleaning procedure.

Bonderite adhesion primer product
Surface Preparation

Adhesion Primers & Promoters

Bonderite conversion coatings and primers prepare metal surfaces before bonding, painting, or related finishing processes. The appropriate treatment depends on substrate alloy, required corrosion protection, downstream adhesive or coating, application method, and process controls.

Talk to our Henkel Experts

Krayden can help compare Henkel materials for bonding, sealing, encapsulation, underfill, electronics assembly, die attach, and thermal management applications. Our team can support product selection, substrate and application requirements, process considerations, and comparison of candidate materials for your assembly.

Contact our teamCall +1 (800) 448-0406

Henkel Quick Reference

Brands Carried
Loctite, Bonderite, Frekote, Stycast, Eccobond, Bergquist
Core Technology
Adhesives, Electronics Assembly & Thermal Management Materials
Top Categories
Adhesives & Sealants, Encapsulants & Underfills, Electronics Assembly, Die Attach
Key Markets
Electronics, Semiconductor, Aerospace, Automotive

780 products

  • Loctite Ablestik 8008HT
    No longer available

    LOCTITE ABLESTIK 8008

    • Snap curable after B stage
    • Low modulus
    • Void free bondline without bleed
  • Loctite Ablestik ABP 8068TB

    LOCTITE ABLESTIK ABP 8068TB

    • Good workability
    • High thermal stability
    • Solder replacement
  • Loctite Ablestik ABP 8068TA
    No longer available

    LOCTITE ABLESTIK ABP 8068TA

    • Excellent workability
    • Dispensable
    • Printable
  • Loctite Ablestik SSP 2020

    LOCTITE ABLESTIK SSP 2020

    • High thermal conductivity
    • High electrical conductivity
    • High die shear strength
  • LOCTITE 3128

    LOCTITE 3128

    • One component
    • Low temperature cure
    • Bonding heat sensitive components
  • LOCTITE ECCOBOND LUX OGR150THTG

    LOCTITE ECCOBOND LUX OGR150THTG

    • Non conductive
    • Photocurable
    • Cures in shadowed areas
  • LOCTITE ABLESTIK 16-1LV
    No longer available

    LOCTITE ABLESTIK 16-1LV

    • Two components
    • Room temperature cure
    • Low volume resistivity
  • LOCTITE SI 5404

    LOCTITE SI 5404

    • Electrical isolation
    • Thermally conductive
    • Bond metallic heat sinks
  • LOCTITE SI 5140

    LOCTITE SI 5140

    • Non corrosive
    • Room temperature vulcanization
    • Alkoxy Silicone
  • LOCTITE SI 5145

    LOCTITE SI 5145

    • Non corrosive
    • Room temperature vulcanization
    • No slumping
  • LOCTITE SF 7387

    LOCTITE SF 7387

    • Activator
    • Very low viscosity
    • Promote cure of acrylic adhesives
  • LOCTITE 3619

    LOCTITE 3619

    • SMD components on PCB
    • Chipbonder
    • Very High dispense speed
  • LOCTITE ABLESTIK 8370C

    LOCTITE ABLESTIK 8370C

    • Gold Filled
    • High electrical conductivity
    • Works on Noble finished substrates
  • LOCTITE ABLESTIK 550K

    LOCTITE ABLESTIK 550K

    • Low cure temperature
    • Hard to bond metals
    • Thermally conductive
  • LOCTITE ECCOBOND F113SC

    LOCTITE ECCOBOND F113SC

    • Two component
    • High Tg
    • Fiber optic assembly
  • LOCTITE 401

    LOCTITE 401

    • Instant adhesive
    • Very high adhesion strength
    • Bond dissimilar substrates
  • LOCTITE ECCOBOND LUX OGRFI146T

    LOCTITE ECCOBOND LUX OGRFI146T

    • Low refractive index
    • Photocurable
    • Cures in shadowed areas
  • LOCTITE ABLESTIK NCA 2350

    LOCTITE ABLESTIK NCA 2350

    • Fast cure
    • Good adhesion
    • Heat sensitive components
  • LOCTITE EDAG 452SS E&C

    LOCTITE EDAG 452SS E&C

    • Screen printable
    • Fast UV cure
    • Excellent adhesion
  • LOCTITE EDAG 456

    LOCTITE EDAG 456

    • Non conductive
    • screen printable
    • Thermoformable
  • LOCTITE ECI 8001 E&C

    LOCTITE ECI 8001 E&C

    • Rapid heating with fast, defined cut-off temperatures, no external control devices needed
    • Printable on most common substrates
    • Screen printable
  • LOCTITE M4100 E&C

    LOCTITE M4100 E&C

    • Conductive
    • screen printable
    • Electroless nickel plateable
  • LOCTITE ABLESTIK 8700E

    LOCTITE ABLESTIK 8700E

    • Electrically conductive
    • Retains high shear strength after thermal cycling
    • Thermally conductive
  • LOCTITE ABLESTIK ABP 8068TD

    LOCTITE ABLESTIK ABP 8068TD

    • Good workability
    • ±50 W/mK Thermal Conductivity
    • High electrical conductivity
  • LOCTITE ECCOBOND D125 F DR
    No longer available

    LOCTITE ECCOBOND D125 F DR

    • Low water absorption
    • Low exotherm
    • Non-sag
  • LOCTITE ECI 7004HR E&C

    LOCTITE ECI 7004HR E&C

    • High Resistivity
    • Screen Printable
    • Flexible low temperature drying cycles
  • LOCTITE NCI 7002 E&C

    LOCTITE NCI 7002 E&C

    • Non-Conductive
    • Screen Printable
    • Flexible low temperature drying cycles
  • LOCTITE ABLESTIK E 8502-1

    LOCTITE ABLESTIK E 8502-1

    • One component
    • Low stress
    • Thermally conductive
  • LOCTITE ABLESTIK NCA 2286AE

    LOCTITE ABLESTIK NCA 2286AE

    • Dual Cure
    • High elongation strength
    • Active alignment in lens holder attach
  • LOCTITE ECI 1006 E&C

    LOCTITE ECI 1006 E&C

    • Halogen free
    • High conductivity
    • Fine line screen printable
  • LOCTITE ABLESTIK 2025DNP

    LOCTITE ABLESTIK 2025DNP

    • Excellent dispense capabilities
    • For mother die in array packaging
    • 260ºC reflow capability for Pb-free applications
  • LOCTITE ECI 1014 E&C

    LOCTITE ECI 1014 E&C

    • Low temperature drying
    • High conductivity
    • Compatible for use with polycarbonate, polyester and polyurethane
  • LOCTITE ABLESTIK FS 849-TI

    LOCTITE ABLESTIK FS 849-TI

    • Low outgassing
    • Low electrical resistance
    • High thermal conductivity - 7.8 W/mK
  • LOCTITE ABLESTIK EMI 8890SB

    LOCTITE ABLESTIK EMI 8890SB

    • Conformal EMI shielding
    • Excellent adhesion on EMC
    • Spray coating
  • LOCTITE ABLESTIK ABP 8068TH

    LOCTITE ABLESTIK ABP 8068TH

    • Robust reliability
    • 150 W/mK Thermal Conductivity
    • Low stress
  • LOCTITE ABLESTIK ABP 6395T

    LOCTITE ABLESTIK ABP 6395T

    • High reliability
    • 30 W/(m-K) Thermal Conductivity
    • Good adhesion to Ag, Cu, PPF, Non-BSM, and BSM die
  • LOCTITE ABLESTIK ATB 125GR

    LOCTITE ABLESTIK ATB 125GR

    • Low ionic content
    • Excellent adhesion on both metal lead frames and BGAs
    • High modulus
  • LOCTITE ECCOBOND LCM 1000-AG1

    LOCTITE ECCOBOND LCM 1000AG-1

    • High Toughness
    • Ultra Low warpage
    • CTE matching Silica
  • LOCTITE ABLESTIK ABP 6392TEA

    LOCTITE ABLESTIK ABP 6392TEA

    • High electrical conductivity
    • High thermal conductivity
    • Good adhesion to a variety of substrates
  • LOCTITE ABLESTIK ABP 8068TI

    LOCTITE ABLESTIK ABP 8068TI

    • High thermal and electrical properties
    • Low sintering temperature
    • High reliability
  • LOCTITE ABLESTIK NCA 2280

    LOCTITE ABLESTIK NCA 2280

    • Non-conductive
    • Fast cure at low temperature
    • High thixotropic index
  • LOCTITE ABLESTIK NCA 2390

    LOCTITE ABLESTIK NCA 2390

    • High dispense aspect ratio
    • Fast cure at low temperature
    • High thixotropic index
  • LOCTITE D125 F

    LOCTITE D125 F

    • Low exotherm
    • High speed dispensing
    • Low cure temperature
  • LOCTITE ABLESTIK 968-4

    LOCTITE ABLESTIK 968-4

    • Electrically Insulating
    • B-Stageable
    • Screen printable
  • LOCTITE ABLESTIK 958-7 | Electrically Conductive Adhesive

    LOCTITE ABLESTIK 958-7 | Electrically Conductive Adhesive

    • Electrically conductive
    • Good adhesion to gold
    • Heat cure
  • LOCTITE 3296 | UV-curable Epoxy Adhesive

    LOCTITE 3296 | UV-curable Epoxy Adhesive

    • Fast UV cure
    • High Tg and low CTE
    • Low shrinkage during & after cure
  • ABP 2100ANP

    LOCTITE ABP 2100ANP | PFAS-Free Die Attach Adhesive

    • Formulated for Pb-free applications
    • High hot/wet adhesion
    • Excellent dispensability
  • LOCTITE 3626M | Surface Mount Adhesive

    LOCTITE 3626M | Surface Mount Adhesive

    • Heat-cured
    • For SMD components to PCB
    • Compatible with syringe and stencil print
  • LOCTITE ABLESTIK ABP 2053SNP

    LOCTITE ABLESTIK ABP 2053SNP

    • Formulated without intentionally added PFAS
    • One-component
    • Low stress
  • Frekote 700-NC GL

    Frekote 700-NC

    • No Chlorinated Solvents
    • High Gloss Finish
    • No Contaminating Transfer
  • Loctite 495

    Loctite 495

    • One-Part Adhesive Form
    • Multi-Substrate Assembly Fixturing
    • Low-Viscosity Adhesive Application
  • Loctite 580 Pipe Sealant

    Loctite 580 Pipe Sealant

    • One-Component Sealing System
    • Low Pressure Sealing for Inactive Metals
    • Room-Temperature Sealing Cure
  • Loctite Ablestik 83C Conductive Epoxy Adhesive

    Loctite Ablestik 83C Conductive Epoxy Adhesive

    • Silver-Filled Epoxy Adhesive
    • 0.0004 ohm-cm Volume Resistivity
    • Electrical-Connection Epoxy Bonding
  • Loctite Ablestik 2116 Non-Conductive Adhesive

    Loctite Ablestik 2116 Non-Conductive Adhesive

    • Metal/Glass/Ceramic/Plastic Staking and Bonding
    • 30-Minute Pot Life
    • 415 V/mil Dielectric Strength
  • BONDERITE C-AK 6849 AERO

    BONDERITE C-AK 6849 AERO

  • BONDERITE C-AK ALUM ETCH 2 AERO

    BONDERITE C-AK ALUM ETCH 2 AERO

    • Cleaning and Etching
    • Uniform Surface Wetting
    • Aluminum Surface Treatment
  • BONDERITE C-AK ALUM ETCH 3 AERO

    BONDERITE C-AK ALUM ETCH 3 AERO

    • Surface Soil Removal
    • Aluminum Surface Etching
    • 0.05 to 0.10 mil/min Etch Rate
  • BONDERITE C-IC DEOXIDOZER

    BONDERITE C-IC DEOXIDOZER

    • Aluminum Deoxidizing, Desmutting, Etching
    • Prepares for Chromating
    • 1 to 10 Minute Application Rate
  • Loctite Ablestik CT 5047-2

    Loctite Ablestik CT 5047-2

    • Electrically Conductive Bonding
    • Room Temperature Curing
    • Electrical Connections Bonding
  • BONDRITE C-AK MIL-ETCH

    BONDRITE C-AK MIL-ETCH

    • Fine Satin or Frosted Etch on Aluminum
    • Low-Foam Alkaline Formulation
    • Scale- and Sludge-Reducing Sequestering Chemistry
  • FREKOTE 44-NC

    FREKOTE 44NC

    • Multi-Cycle Mold Release
    • Reduced Mold-Surface Contamination Risk
    • Non-Silicone Downstream-Compatible Formulation
  • FREKOTE RC321

    FREKOTE RC-321

    • Consistent Multi-Cycle Mold Release
    • Reduced Resin Adhesion to Mold Surfaces
    • Semi-Permanent Low-Residue Coating
  • Loctite FREKOTE R-110 55 GAL

    Loctite FREKOTE R-110

    • Multi-Cycle Mold Release
    • Reduced Resin Adhesion to Molds
    • Semi-Permanent Low-Residue Coating
  • Teroson AL 6302 Heat Curing Sealant

    Teroson AL 6302 Heat Curing Sealant

  • LOCTITE ABLESTIK 104

    LOCTITE ABLESTIK 104

    • Up to 230 deg C Service
    • Long Working Time
    • High Tensile Lap Shear Strength
  • LOCTITE ABLESTIK 16-1

    LOCTITE ABLESTIK 16-1

    • Electrically conductive
    • Room temperature or heat cure
    • Good adhesion
  • LOCTITE ABLESTIK 2101

    LOCTITE ABLESTIK 2101

    • 23 N/mm^2 Aluminum Lap Shear
    • High-Resistivity Electrical Insulation
    • Fuel, Oil, and Acid Resistance
  • LOCTITE ABLESTIK 2106T

    LOCTITE ABLESTIK 2106T

    • Shore D 72 within 60 Minutes
    • 410 V/mil Dielectric Strength
    • Metal-to-Masonry Multi-Substrate Bonding
  • LOCTITE ABLESTIK 2112

    LOCTITE ABLESTIK 2112

    • Critical Electronics/Aerospace Bonding
    • Non-Sag PCB Component Staking
    • Electrical Insulation and Environmental Resistance
  • LOCTITE ABLESTIK 2113

    LOCTITE ABLESTIK 2113

    • Low-Viscosity Optical Bonding
    • Fine-Detail Flow and Wetting
    • Electrically Insulating Cured Adhesive
  • LOCTITE ABLESTIK 2114

    LOCTITE ABLESTIK 2114

    • Optically Clear Bonding
    • 50 N/mm^2 Cured Tensile Strength
    • Broad Metal/Glass/Ceramic/Plastic Compatibility
  • ABLESTIK 2115

    ABLESTIK 2115

    • Shock- and Temperature-Cycling Resistance
    • Low-Viscosity Precision Optic Bonding
    • 60-Watt Laser-Energy Resistance
  • ABLESTIK 2135D

    ABLESTIK 2135D

    • Tough, Durable Epoxy for Bonding, Laminating, Sealing
    • 1,200 mPa s Mixed Viscosity
    • 2.7 x 10^13 ohm-cm Volume Resistivity
  • ABLESTIK 2143D

    ABLESTIK 2143D

    • Medium-Viscosity Application Control
    • 1 x 10^14 ohm-cm Volume Resistivity
    • Room-Temperature Adhesive Cure
  • ABLESTIK 2156

    ABLESTIK 2156

    • 0.84 W/(m K) Thermal Conductivity
    • Heat-Sensitive Component Staking
    • -70 to 100 deg C Operating Range
  • ABLESTIK 2158

    ABLESTIK 2158

    • Electrically Insulating Staking Epoxy
    • Flexible Mismatched-Adherend Bonding
    • 2 x 10^15 ohm-cm Volume Resistivity
  • ABLESTIK 2248

    ABLESTIK 2248

    • Thixotropic Application Control
    • 14.8 kV/mm Dielectric Strength
    • 1-Hour Working Window
  • ABLESTIK 2332-17U

    ABLESTIK 2332-17U

    • Solvent-Free Bonding Formulation
    • 90-Minute 100 deg C Cure
    • 24 N/mm^2 Aluminum Lap Shear
  • ABLESTIK 24

    ABLESTIK 24

    • Water-Clear Thin-Bondline Adhesive
    • 30-Minute Pot Life
    • Flexible Cured Adhesive
  • ABLESTIK 286

    ABLESTIK 286

    • 1.04 W/(m K) Thermal Interface
    • 30-Minute Working Window
    • Room-Temperature Thermal Interface Cure
  • ABLESTIK 2907

    ABLESTIK 2907

    • Electrically Conductive Bonding
    • Room-Temperature Adhesive Cure
    • Glass-to-Plastic Epoxy Bonding
  • ABLESTIK 293-1

    ABLESTIK 293-1

    • Difficult-Substrate General Assembly Bonding
    • 37.9 N/mm^2 Aluminum Lap Shear
    • 3.20 x 10^14 ohm-cm Volume Resistivity
  • ABLESTIK 293-21

    ABLESTIK 293-21

    • Strong Bonding to Difficult Metallic Substrates
    • 90-Minute 75 deg C Cure
    • 1.0 x 10^13 ohm-cm Volume Resistivity
  • ABLESTIK 2958

    ABLESTIK 2958

    • Electrically Conductive Bonding
    • 40,000 mPa s Mixed Viscosity
    • 15-Minute 100 deg C Cure
  • ABLESTIK 369-3

    ABLESTIK 369-3

    • 0.0005 ohm-cm Volume Resistivity
    • 4-Hour 74 deg C Cure
    • Two-Hour Working Window
  • ABLESTIK 506

    ABLESTIK 506

    • Flexible Cured Adhesive
    • 0.9 W/(m K) Thermal Conductivity
    • Reworkable Bonding Material
  • ABLESTIK 550

    ABLESTIK 550

    • Film-Format Bonding for Difficult Surfaces
    • 30-Minute 150 deg C Cure
    • 39 N/mm^2 Aluminum Lap Shear
  • ABLESTIK 568

    ABLESTIK 568

    • 2.5 x 10^14 ohm-cm Volume Resistivity
    • 2-Hour 95 deg C Cure
    • 3 mil Glass-Fabric-Supported Film
  • ABLESTIK 59C

    ABLESTIK 59C

    • 7 W/(m K) Thermal Conductivity
    • 55 to 260 deg C Service Range
    • Reworkable Bonding Material
  • ABLESTIK 60L

    ABLESTIK 60L

    • 50 ohm-cm Volume Resistivity
    • 30-Minute 25 deg C Cure
    • 55 to 130 deg C Service Range
  • ABLESTIK 77-1S

    ABLESTIK 77-1S

    • One-Component, Solvent-Free Epoxy for Attaching Surface-Mounted Devices
    • Smooth Non-Tailing Non-Sag Consistency
    • 91-Day Working Window
  • ABLESTIK 77-2LTC

    ABLESTIK 77-2LTC

    • One-Component, Solvent-Free Epoxy for Attaching Surface-Mount Devices
    • Smooth Non-Tailing Non-Sag Consistency
    • 2.5 x 10^14 ohm-cm Volume Resistivity
  • ABLESTIK 816H01

    ABLESTIK 816H01

    • 2.0 W/(m K) Thermal Interface
    • Three-Hour Working Window
    • Room-Temperature Thermal Interface Cure
  • ABLESTIK 8380

    ABLESTIK 8380

    • Reduced Tailing and Stringing in Smart-Card Assembly
    • 1-Minute 150 deg C Cure
    • 0.0005 ohm-cm Volume Resistivity
  • ABLESTIK 83CJ

    ABLESTIK 83CJ

    • 0.0004 ohm-cm Volume Resistivity
    • 45-Minute Working Window
    • Cold-Solder-Type Electrical Connections
  • ABLESTIK 84-1LMINB

    ABLESTIK 84-1LMINB

    • 0.0001 ohm-cm Volume Resistivity
    • Screen-Printable Epoxy Bonding
    • 30-Minute Working Window
  • ABLESTIK 85-1

    ABLESTIK 85-1

    • Gold-Filled Conductive Die-Attach Adhesive
    • 49 N/mm^2 Shear Strength
    • 1-Hour 150 deg C Cure
  • ABLESTIK 967-3

    ABLESTIK 967-3

    • 2 x 10^13 ohm-cm Volume Resistivity
    • 6-Hour 65 deg C Cure
    • 1:1 Meter-Mix Processing
  • ABLESTIK 976-1

    ABLESTIK 976-1

    • Electrically Conductive Thermal Interface
    • 2.1 W/(m K) Thermal Interface
    • 1:1 Meter-Mix Processing
  • ABLESTIK CF3366

    ABLESTIK CF3366

    • 0.0003 ohm-cm Volume Resistivity
    • 5.17 N/mm^2 Aluminum Lap Shear
    • Flexible Cured Adhesive
  • ABLESTIK CT5047-2

    ABLESTIK CT5047-2

    • Conductive Bonding for Temperature-Sensitive Electrical Connections
    • 24-Hour 25 deg C Cure
    • 2-Hour Working Window
  • ABLESTIK ECF 550

    ABLESTIK ECF 550

    • Conductive Grounding and RF-Shielding Film
    • Controlled Film Processing with Flexible Supply Formats
    • 20 N/mm^2 Lap Shear
  • ABLESTIK ECF561E-1

    ABLESTIK ECF 561E

    • Electrically Conductive Bonding
    • Flexible Cured Adhesive
    • 1.6 W/(m K) Thermal Conductivity
  • ABLESTIK ECF 568

    ABLESTIK ECF 568

    • Electrically Conductive Application
    • 2-Hour 95 deg C Cure
    • Sheet Stock or Die-Cut Preforms
  • ABLESTIK G909

    ABLESTIK G 909

    • High-Strength Structural Bonding
    • Thixotropic Non-Sag Placement
    • 90-Minute 100 deg C Cure
  • ABLESTIK KE 4238

    ABLESTIK KE 4238

    • Conductive Bonding for Heat-Sensitive Assemblies
    • 21 W/(m K) Thermal Conductivity
    • 2-Hour 60 deg C Cure
  • ABLESTIK KS 0004

    ABLESTIK KS 0004

    • 0.01 ohm-cm Volume Resistivity
    • 2-Hour 60 deg C Cure
    • Conductive Bonding and Encapsulation Utility
  • ABLESTIK KS 4008

    ABLESTIK KS 4008

    • 0.01 ohm-cm Conductive Bonding
    • Aircraft Static-Discharger Bonding
    • Room-Temperature or Heat Cure
  • BONDERITE C-AD 4215

    BONDERITE C-AD 4215

  • BONDERITE C-AK 298

    BONDERITE C-AK 298

    • Non-Silicated Aluminum Immersion Cleaner
    • Multi-Soil Removal and Free Rinsing
    • 54 to 82 deg C Immersion Cleaning
  • BONDERITE C-AK 4215 NC-LT

    BONDERITE C-AK 4215 NC-LT

    • Low-Temperature Multi-Metal Cleaning
    • Fuel/Hydraulic Component Cleaning
    • Chromate-Free Low-Foam Noncorrosive Formulation
  • BONDERITE C-AK 4316

    BONDERITE C-AK 4316

    • Heat-Scale Conditioning for Multiple Alloys
    • Lower-Temperature Molten-Salt Bath Processing
    • Nonflammable Titration-Controlled Bath Maintenance
  • BONDERITE C-AK 4338LP1

    BONDERITE C-AK 4338LP1

    • Two-Part Alkaline-Permanganate System Component
    • Jet-Engine Heat-Scale Conditioning
    • Liquid-Concentrate Bath Make-Up
  • BONDERITE C-AK 4338LP2

    BONDERITE C-AK 4338LP2

    • High-Temperature Oxide-Scale Conditioning
    • Equal-Volume Two-Liquid Mixing
    • 15 to 25% Component Concentration
  • BONDERITE C-AK 5948-DPM

    BONDERITE C-AK 5948-DPM

    • Painted/Unpainted Aircraft Cleaning
    • Nonstaining Free-Rinsing Aluminum Cleaning
    • Phosphate/Chromate-Free Immersion/Ultrasonic Cleaning
  • BONDERITE C-AK 5948-R

    BONDERITE C-AK 5948-R

  • BONDERITE C-AK 909

    BONDERITE C-AK 909

    • Heavy-Soil Multi-Metal Degreasing
    • Immersion or Ultrasonic Cleaning
    • Caustic-Soda-Free Chelating Formulation
  • BONDERITE C-AK ALTREX

    BONDERITE C-AK ALTREX

    • Inhibited Non-Etching Aluminum Cleaning
    • BAC-5749 Medium-Duty Soak Qualification
    • Buffered Hard-Water Bath Control
  • BONDERITE C-AK ALUM

    BONDERITE C-AK ALUM

    • Removal of Light Soils with Immersion Etching
    • Promotes Uniform Wetting Through Low Surface Tension
    • 40 to 80 deg C Service Range
  • BONDERITE C-AK EC-202L

    BONDERITE C-AK EC

    • Multi-Soil Phosphate-Line Equipment Cleaning
    • Spray, Immersion, or Recirculation Cleaning
    • Two-Step Descaling Bath Control
  • BONDERITE C-AK ETCH

    BONDERITE C-AK ETCH 9HL

    • High-Copper Aluminum Chem-Mill Processing
    • Controlled Immersion Chemical Milling
    • Improved Line Definition and Etch Uniformity
  • BONDERITE C-AK LS

    BONDERITE C-AK LS

    • Rolling-Oil Steel-Strip Cleaning
    • Dip, Spray, or Electrolytic Cleaning
    • Oil-Separating Emulsion Behavior
  • BONDERITE C-AK MIL-ETCH

    BONDERITE C-AK MIL-ETCH

    • Uniform Fine Satin or Frosted Etch
    • Low-Foam Low-Mist Alkaline Etching
    • BAC 5786 Operating Conditions
  • BONDERITE C-AK VITKL

    BONDERITE C-AK VITKL

    • Ferrous/Titanium Tenacious-Soil Removal
    • Boeing BAC 5749 Compliance
    • Low-Foaming Quick-Rinse Bath Control
  • BONDERITE C-IC 2310

    BONDERITE C-IC 2310

    • Chromium-Free Aluminum Deoxidizing Cleaner
    • No-Heat Immersion/Spray Cleaning
    • MIL-W-6858C Deoxidizing Compliance
  • BONDERITE C-IC 33

    BONDERITE C-IC 33

    • Non-Flammable Bonding Formulation
    • Brush, Spray, or Immersion Application
    • Adhesion-Promoting Surface Treatment
  • BONDERITE C-IC 4409

    BONDERITE C-IC 4409

    • Ferrous/Nonferrous Alloy Cleaning and Deoxidizing
    • Hand-Wipe, Immersion, or Spray Processing
    • Water/Steam-Rinsable Rust Removal
  • BONDERITE C-IC 457

    BONDERITE C-IC 457

    • Heavy-Oxidation Aluminum/Magnesium Deoxidizing
    • Non-Flammable Phosphate-Free Formulation
    • Pre-Paint Surface Conditioning
  • BONDERITE C-IC 79

    BONDERITE C-IC 79

    • Phosphoric-Acid Oxidation/Corrosion Cleaner
    • Brush, Immersion, or Spray Application
    • Pre-Paint/Conversion-Coating Surface Preparation
  • BONDERITE C-IC ALDOX

    BONDERITE C-IC ALDOX

    • Chromate-Free Aluminum Deoxidizing and Desmutting
    • Boeing BAC 5765 Qualification
    • Ambient Spray or Immersion Processing
  • BONDERITE C-IC SMUTGO

    BONDERITE C-IC SMUTGO

    • Chromate-Free Acid Cleaner
    • Ambient Immersion or Spray Processing
    • Low Electrical Surface Resistance
  • BONDERITE C-SO 2382

    BONDERITE C-SO 2382

    • Aerospace NESHAP/AQMD Solvent Compliance
    • Fast-Evaporating Residue-Free Surface Prep
    • Noncorrosive Ferrous/Nonferrous Metal Cleaning
  • BONDERITE L-FG LS2127

    BONDERITE L-FG LS 2127

    • Up to 1649 deg C Service
    • Anti-Stick Non-Ferrous Tooling Coating
    • Brush, Spray, or Dip Application
  • BONDERITE L-FM PRETREAT

    BONDERITE L-FM PRETREAT

    • Heat-Treatment Scale Inhibition
    • Lubricating Protective Forming Coating
    • Fast-Drying Post-Treatment Descaling Aid
  • BONDERITE L-GP 460

    BONDERITE L-GP 460

    • High-Purity Graphite Anti-Seize Lubricant
    • High-Load Extreme-Pressure Lubrication
    • Up to 538 deg C Service
  • BONDERITE M-CR 1001

    BONDERITE M-CR 1001

    • Clear Aluminum Chromate Conversion Coating
    • Paint-Adhesion and Corrosion-Resistance Improvement
    • Spray or Immersion Application
  • BONDERITE M-ED 1000

    BONDERITE M-ED 1000

    • Nickel Acetate-Based Sealing Process
    • Reduced Smut, Powdering, and Yellowing
    • Commercial and Selected Military Anodizing Seal Processes
  • BONDERITE M-FE 101

    BONDERITE M-FE 101

    • One-Step Steel Cleaning and Phosphating
    • Improved Paint Adhesion, Coating Durability, and Corrosion Resistance
    • Steam Gun and High-Pressure Manual Applications
  • BONDERITE M-FE HMF-1080

    BONDERITE M-FE HMF-1080

    • Heavy-Metal-Free Multi-Metal Clean/Phosphate Process
    • Improved Paint Adhesion and Corrosion Resistance
    • Multi-Metal Spray-Tunnel Pretreatment
  • BONDERITE M-MN LUBRITE 2

    BONDERITE M-MN LUBRITE 2

    • Oil-Absorptive Phosphate Lubricating Coating
    • Rapid Break-In and Reduced Scuffing
    • Corrosion-Resistant Oil-Finishing Surface
  • BONDERITE S-FN 309

    BONDERITE S-FN 309

    • Fast-Drying PTFE Dry-Film Lubrication
    • Wood/Metal/Rubber/Plastic/Glass Surface Adhesion
    • Spray/Brush/Dip/Roller Application Methods
  • BONDERITE S-FN 310A

    BONDERITE S-FN 310A

    • PTFE Dry-Film Low-Friction Release
    • Longer Wear Life than Pure PTFE
    • 149 deg C Low-Temperature Cure
  • BONDERITE S-FN 330

    BONDERITE S-FN 330

    • Low-Friction Stick-Slip-Resistant Coating
    • 500-Hour Salt-Spray/Humidity Resistance
    • Up to 150 deg C Service
  • BONDERITE S-FN 333

    BONDERITE S-FN 333

  • BONDERITE S-FN GP 1904

    BONDERITE S-FN GP 1904

    • PTFE/Graphite Dry-Film Lubricant
    • Corrosion and Solvent Resistance
    • Multi-Substrate Dry Lubrication
  • BONDERITE S-OT 310B

    BONDERITE S-OT 310B

    • PTFE Dry-Film Low-Friction Lubrication
    • Oil, Solvent, and Chemical Resistance
    • Metal and Rubber Coating Process
  • BONDERITE S-ST 5351

    BONDERITE S-ST 5351

    • Ambient-Temperature Aerospace Coating Removal
    • Viscous Vertical-Surface Stripping
    • MIL-R-81294 Aerospace Approval
  • BONDERITE S-ST 5668

    BONDERITE S-ST 5668

    • Aircraft Polyurethane/Epoxy Coating Removal
    • Phenol-, Chromate-, Solvent-, and Acid-Free Formulation
    • MIL-R-83936B Specification Compliance
  • ECCOBOND F112

    ECCOBOND F112

    • Low-Viscosity Controlled Dispensing
    • Thermal-Shock and Impact Resistance
    • Low-Stress No-Pistoning Connections
  • ECCOBOND F123

    ECCOBOND F123

    • Fast Application Cure
    • Good Capillary Application
    • Thermal Shock Resistance
  • ECCOBOND F131

    ECCOBOND F131

    • Clear Fiber-Optic Assembly Epoxy
    • Room-Temperature or Accelerated Heat Cure
    • High-Tg Cured Epoxy
  • FREKOTE 710-NC

    FREKOTE 710-NC

    • Reduced Cleaning Frequency
    • Thermally Stable Coating
    • Compatible with Multiple Epoxy Molding Compounds (EMCs)
  • FREKOTE 720-NC

    FREKOTE 720-NC

    • Colorless Low-VOC Mold Release
    • Solvent-Based Liquid Release Application
    • Industrial Mold-Release Processing
  • FREKOTE 770-NC

    FREKOTE 770-NC

    • High-Cycle Semiconductor Mold Release
    • Low-Residue Mold Release
    • Epoxy-Molding-Compound Temperature Compatibility
  • FREKOTE 800-NC

    FREKOTE 800-NC

    • Repeat-Cycle Mold Release
    • Low-Residue Mold Release
    • Semiconductor Epoxy-Molding Temperature Compatibility
  • FREKOTE 815-NC

    FREKOTE 815-NC

    • Durable, Consistent Mold Release for High-Cycle Applications
    • Precision Silicone Formulation Compatible with Semiconductor Molding
    • Improved Yield Mold Release
  • FREKOTE AC4368

    FREKOTE AC4368

    • Combined Mold Release and Conditioning
    • Multi-Resin Molding Compatibility
    • 5 to 10-Minute Solvent Evaporation
  • FREKOTE AQUALINE R-150

    FREKOTE R-150

    • Non-Flammable Mold Release Formulation
    • Natural/Synthetic Rubber Release and Slip
    • 60 to 200 deg C Mold Operation
  • FREKOTE B-15

    FREKOTE B-15

    • One-Part Polymeric Mold Sealing
    • 30-Minute Recoat Window
    • 24-Hour Full-Cure Sealing
  • FREKOTE EXITT-I

    FREKOTE EXITT-I

    • High-Gloss Molded-Part Finish Retention
    • Urethane-Elastomer Mold Release
    • Wipe, Brush, or Spray Application
  • FREKOTE FMS

    FREKOTE FMS

    • Composite-Mold Microporosity Sealing
    • High-Gloss Prepared Mold Surface
    • 20-Minute Final-Coat Cure at 20 deg C
  • FREKOTE FMS-100

    FREKOTE FMS-100

    • Room-Temperature Mold-Sealer Cure
    • Microporosity-Sealing Mold Preparation
    • High-Gloss Release-Ready Surface
  • FREKOTE HMT

    FREKOTE HMT

    • Hot-Mold Direct Application
    • Standalone or Touch-Up Release
    • Multiple Releases without Transfer Buildup
  • FREKOTE PMC

    FREKOTE PMC

    • Polyester-Mold Wax Removal
    • Multi-Soil Mold Cleaning
    • FREKOTE Sealer/Release Surface Preparation
  • FREKOTE R100

    FREKOTE R100

    • Multi-Cycle Mold Release
    • Reduced Resin Adhesion to Molds
    • Semi-Permanent Low-Residue Coating
  • FREKOTE R-120

    FREKOTE R-120

    • Semi-Permanent Rubber-Mold Release Coating
    • 4-Minute 150 deg C Cure
    • Multiple Releases with Low Transfer
  • FREKOTE R220

    FREKOTE R-220

    • High-Slip EPDM/Elastomer Release
    • 60 to 205 deg C Mold Operation
    • 4-Minute 149 deg C Cure
  • FREKOTE WOLO

    FREKOTE WOLO

    • Wipe Application Method
    • Mold Release and Sealing Capability
    • 15-Minute 20 deg C Cure
  • LOCTITE 122S

    LOCTITE 122S

    • Thixotropic Application Control
    • Non-Staining Mold Release Formulation
    • Non-Flammable Mold Release Formulation
  • LOCTITE 190017

    LOCTITE 190017

    • Anaerobic Adhesive Technology
    • Above 100 deg C Flash Point
    • Clear Liquid Formulation
  • LOCTITE 2047

    LOCTITE 2047

    • One-Component Threadlocking System
    • Medium-Strength Thread Retention
    • Slow Cure Profile
  • LOCTITE 242

    LOCTITE 242

    • Medium-Strength Thread Retention
    • Vibration-Resistant Fastener Threadlocking
    • Thread Sealing Protection
  • LOCTITE 246

    LOCTITE 246

    • High-Strength Thread Retention
    • Vibration-Resistant Fastener Threadlocking
    • One-Component Threadlocking System
  • LOCTITE 262

    LOCTITE 262

    • One-Component Threadlocking System
    • High-Strength Thread Retention
    • Thixotropic Application Control
  • LOCTITE 263

    LOCTITE 263

    • High-Strength Thread Retention
    • Low-Viscosity Threadlocking Application
    • High-Temperature Thread Retention
  • LOCTITE 266

    LOCTITE 266

    • Oil-Tolerant Threadlocking Application
    • High-Strength Thread Retention
    • Thixotropic Application Control
  • LOCTITE 2701

    LOCTITE 2701

    • High-Strength Thread Retention
    • Low-Viscosity Threadlocking Application
    • Fluorescent Under UV Light
  • LOCTITE 271

    LOCTITE 271

    • High-Strength Thread Retention
    • Low-Viscosity Threadlocking Application
    • Large Threaded-Fastener Locking
  • LOCTITE 272

    LOCTITE 272

    • High-Strength Thread Retention
    • Medium-Viscosity Application Control
    • No Mixing Required
  • LOCTITE 277

    LOCTITE 277

    • M25 Bolt/Stud Threadlocking
    • High-Strength Thread Retention
    • Medium-Viscosity Threadlocking Application
  • LOCTITE 290

    LOCTITE 290

    • Wicking-Grade Thread Application
    • Low-Viscosity Threadlocking Application
    • High-Strength Thread Retention
  • LOCTITE 294

    LOCTITE 294

    • Wicking-Grade Thread Application
    • Low-Viscosity Threadlocking Application
    • High-Strength Thread Retention
  • LOCTITE 348

    LOCTITE 348

    • Room-Temperature Adhesive Cure
    • Non-Sag Placement Control
    • Hand-Mixable Bonding Material
  • LOCTITE 3614

    LOCTITE 3614

    • One-Component Heat-Cure Epoxy
    • SMD Attachment Applications
    • High Wet-Strength Processing
  • LOCTITE 382

    LOCTITE 382

    • One-Component Adhesive System
    • Clear Gel Formulation
    • Gap-Filling Cyanoacrylate Bonding
  • LOCTITE 4013

    LOCTITE 4013

    • Medium-Viscosity Cyanoacrylate Adhesive
    • ISO 10993 Biocompatibility
    • Disposable Medical-Device Assembly
  • LOCTITE 403

    LOCTITE 403

    • Low-Odor Bonding Processing
    • Low-Blooming Bonding Cure
    • High-Viscosity Placement Control
  • LOCTITE 404

    LOCTITE 404

    • Optically Clear Bondline
    • Fast Adhesive Cure
    • Low-Viscosity Adhesive Application
  • LOCTITE 4081

    LOCTITE 4081

    • Very-Low-Viscosity Cyanoacrylate Adhesive
    • Low-Odor Adhesive Cure
    • Disposable Medical-Device Assembly
  • LOCTITE 409

    LOCTITE 409

    • High-Viscosity Placement Control
    • to Plastics Bonding
    • Reduced Dripping and Migration
  • LOCTITE 410

    LOCTITE 410

    • Rubber-Toughened Cyanoacrylate Adhesive
    • Visible Cured Bondline
    • Dynamic/Impact-Loading Adhesive Bonding
  • LOCTITE 411

    LOCTITE 411

    • High-Viscosity Cyanoacrylate Gel
    • Controlled Non-Sag Application
    • High Peel Strength
  • LOCTITE 415

    LOCTITE 415

    • High-Viscosity Cyanoacrylate Adhesive
    • Documented MIL-A-46050C/A-A-3097 Qualification
    • Chemical and Environmental Resistance
  • LOCTITE 416

    LOCTITE 416

    • High-Viscosity One-Part Cyanoacrylate
    • Documented MIL-A-46050C/A-A-3097 Qualification
    • Multi-Material Plastic/Rubber/Metal Bonding
  • LOCTITE 422

    LOCTITE 422

    • High-Viscosity Cyanoacrylate Gel
    • Transparent Cured Bondline
    • Documented MIL-A-46050C/A-A-3097 Qualification
  • LOCTITE 426

    LOCTITE 426

    • Toughened Structural Bonding
    • Impact-Resistant Cyanoacrylate Bonding
    • Gel-Consistency Bonding Placement
  • LOCTITE 444

    LOCTITE 444

    • TAK PAK Accelerator Compatibility
    • One-Component Cyanoacrylate Adhesive
    • Documented A-A-3097 Qualification
  • LOCTITE 454

    LOCTITE 454

    • Thixotropic Application Control
    • High-Strength Structural Bonding
    • Moisture-Cure Bonding Processing
  • LOCTITE 455

    LOCTITE 455

    • Low-Odor Bonding Processing
    • Gel-Consistency Bonding Placement
    • Low-Blooming Bonding Cure
  • LOCTITE 496

    LOCTITE 496

    • Fast Bonding Cure
    • Medium-Viscosity Application Control
    • One-Component Adhesive System
  • LOCTITE 498

    LOCTITE 498

    • General-Purpose Cyanoacrylate Adhesive
    • Cured Thermal-Cycling Resistance
    • Cured Humidity Resistance
  • LOCTITE 499

    LOCTITE 499

    • Non-Sag Cyanoacrylate Gel
    • One-Component Adhesive System
    • Vertical/Overhead Adhesive Applications
  • LOCTITE 545

    LOCTITE 545

    • One-Component Sealing System
    • Thread Sealing and Locking
    • Assembly Lubricity Sealant Formulation
  • LOCTITE 554

    LOCTITE 554

    • High Solvent Resistance
    • Thread Sealing Up to 50mm
    • One-Component Sealing System
  • LOCTITE 566

    LOCTITE 566

    • Low-Strength Thread Sealing
    • Vibration-Resistant Thread Sealing
    • One-Component Sealing System
  • LOCTITE 567

    LOCTITE 567

    • High-Lubricity Thread Assembly
    • Anaerobic Thread Sealing
    • High-Temperature Service Sealant Formulation
  • LOCTITE 569

    LOCTITE 569

    • Low-Viscosity Sealing Application
    • Vibration-Resistant Thread Sealing
    • Broad Fluid Resistance
  • LOCTITE 592

    LOCTITE 592

    • High-Lubricity Thread Assembly
    • Immediate Low-Pressure Seal
    • Elevated Temperature Fluid Resistance
  • LOCTITE 609

    LOCTITE 609

    • High-Strength Cylindrical Retention
    • Low-Viscosity Retention Application
    • Vibration and Fluid Resistance
  • LOCTITE 620

    LOCTITE 620

    • High Temperature Retention
    • Gap-Filling Cylindrical Retention
    • High Mechanical and Fluid Resistance
  • LOCTITE 648

    LOCTITE 648

    • High-Strength Cylindrical Retention
    • Metal Compatibility Cylindrical Retention
    • Heat, Oil, and Contamination Resistance
  • LOCTITE 680

    LOCTITE 680

    • High-Strength Cylindrical Retention
    • Gap-Filling Cylindrical Retention
    • Heat and Fluid Resistance
  • LOCTITE 962T

    LOCTITE 962T

    • Thixotropic Application Control
    • High-Strength Joint Sealing
    • Heat-Resistant Sealing Service
  • LOCTITE LB 8008 C5-A

    LOCTITE LB 8008 C5-A

    • Copper-Based Anti-Seize Paste
    • Galling Prevention in Assembly
    • Against Corrosion and Oxidation Protection
  • LOCTITE CAT 14

    LOCTITE CAT 14

    • Powdered Anhydride Epoxy Hardener
    • Long Epoxy Working Life
    • 3-Hour Cure at 150 deg C
  • LOCTITE CAT 15

    LOCTITE CAT 15

    • Liquid Polyamide Epoxy Hardener
    • Two-Hour Pot Life
    • 80 deg C Accelerated Cure
  • LOCTITE CAT 15-LV

    LOCTITE CAT 15 LV

    • Low-Viscosity Epoxy Hardener
    • 120-Minute Working Time
    • Rigid/Semi-Rigid/Flexible Epoxy Systems
  • LOCTITE CAT 17M-1

    LOCTITE CAT 17M-1

    • Anhydride-Based Epoxy Hardener
    • Non-Flammable Curing Agent
    • Electronic/Industrial Resin Systems
  • LOCTITE CAT 21

    LOCTITE CAT 21

    • Low-Viscosity Polyoxyalkylene Amine Curative
    • One-Hour Pot Life
    • Large-Mass Epoxy Castings
  • LOCTITE CAT 23LV

    LOCTITE CAT 23LV

    • Low-Viscosity Polyamine Epoxy Catalyst
    • Water-Soluble Curing Agent
    • Low-VOC Amber Liquid
  • LOCTITE CAT 24LV

    LOCTITE CAT 24LV

    • Low-Viscosity Epoxy Curing Agent
    • Long Epoxy Pot Life
    • Low-Temperature Cured Epoxy Performance
  • LOCTITE CAT 27-1

    LOCTITE CAT 27-1

    • Low-CTE Cured Epoxy
    • Two-Hour Working Time
    • Chemical-Resistant Cured Epoxy
  • LOCTITE CAT 43

    LOCTITE CAT 43

    • Liquid Polyamine Epoxy Catalyst
    • Chemical-Resistant Cured Systems
    • LOCTITE Encapsulant Compatibility
  • LOCTITE CAT 50-2

    LOCTITE CAT 50-2

    • Low-Viscosity Liquid Catalyst
    • Dibutyltin Dilaurate Chemistry
    • Consistent Catalytic Activity
  • LOCTITE CAT B97

    LOCTITE CAT B97

    • Low/Medium-Viscosity Epoxy Catalyst
    • Encapsulation and Potting Systems
    • Adhesion and Electrical Insulation
  • LOCTITE CAT9

    LOCTITE CAT9

    • Modified Aliphatic Amine Hardener
    • Chemical-Resistant Cured Epoxy
    • -40 to 130 deg C Service
  • LOCTITE D124F-1

    LOCTITE D124F-1

    • One-Component Adhesive System
    • High Dot Profile
    • No-Stringing Bonding Application
  • LOCTITE EDAG 1415M

    LOCTITE EDAG 1415M

    • Silver-Filled Coating Application
    • Low-Resistance Coating Application
    • No Primer or Topcoat Required
  • LOCTITE EDAG 423SS

    LOCTITE EDAG 423SS

    • Graphite-Filled Conductive Ink
    • Low-Voltage Circuit Applications
    • Broad Screen-Printing Equipment Compatibility
  • LOCTITE EF562

    LOCTITE EF562

    • Foaming Epoxy Film Adhesive
    • Uniform Cell Structure
    • Dual-Cure Bonding Processing
  • LOCTITE H4500

    LOCTITE H4500

    • 15-Minute Working Time
    • High Impact and Peel Strength
    • Primerless Structural Bonding
  • LOCTITE LB8009

    LOCTITE LB8009

    • Steel Compatibility Paste Material
    • Improved Clamp Load Consistency
    • Non-Curing Assembly Formulation
  • LOCTITE LB8023

    LOCTITE LB8023

    • Calcium-Sulfonate Grease Formulation
    • High-Lubricity Thread Assembly
    • Galvanic Corrosion Prevention
  • LOCTITE LB8034

    LOCTITE LB8034

    • Synthetic PAO-Based Grease
    • Long-Life Equipment Lubrication
    • Water and Corrosion Resistance
  • LOCTITE LB8036

    LOCTITE LB8036

    • Non-Metallic Grease Material
    • High-Lubricity Thread Assembly
    • 29C to 1093C Service Temperature
  • LOCTITE LB8040

    LOCTITE LB8040

    • -43 deg C Freeze-and-Release Cooling
    • Fast Penetrating Lubricant
    • Corrosion-Protective Residual Film
  • LOCTITE LB8150

    LOCTITE LB8150

    • Graphite/Aluminum Anti-Seize Lubricants
    • Extreme-Pressure Additive Package
    • MIL-PRF-907-H Requirement Compliance
  • LOCTITE LB8700

    LOCTITE LB8700

    • Molybdenum Disulfide Anti-Seize Formulation
    • Galling Prevention in Assembly
    • Improved Clamp Load Consistency
  • LOCTITE LB8801

    LOCTITE LB8801

    • Non-Curing Silicone Grease Formulation
    • High and Low Temperature Stability
    • Metal and Plastic Compatibility
  • LOCTITE MR5412

    LOCTITE MR5412

    • Solvent-Based Neoprene Contact Adhesive
    • Fast Air-Dry Tack
    • Repositionable During Initial Assembly
  • LOCTITE SF 7840

    LOCTITE SF 7840

    • Biodegradable Aqueous Degreaser
    • Hazardous-Solvent-Free Aqueous Formulation
    • Non-Flammable Non-Caustic Cleaner
  • LOCTITE SF7090

    LOCTITE SF7090

    • Accelerates Cure of Loctite Anaerobic Adhesives
    • Solvent-Free Bonding Formulation
    • Passive Metals and Inert Materials
  • LOCTITE SF712

    LOCTITE SF712

    • Loctite SF712 | Cyanoacrylate Adhesive Activator
    • Fast Assembly Fixturing
    • Low-Viscosity Bonding Flow
  • LOCTITE SF7452

    LOCTITE SF7452

    • Cyanoacrylate Adhesive Cure Accelerator
    • Fast Assembly Fixturing
    • Low-Viscosity Bonding Flow
  • LOCTITE SF768

    LOCTITE SF768

    • Cyanoacrylate Residue Removal
    • Very-Low-Viscosity Solvent Cleaner
    • Surface Cleaning and Debonding
  • LOCTITE SICOMET 100

    LOCTITE SICOMET 100

    • 0.01 to 0.50 mm Gap Fill
    • Fast Moisture-Cure Fixturing
    • Strong Rubber/Plastic Adhesion
  • ABLESTIK 3119

    ABLESTIK 3119

    • Low-Temperature Heat Cure
    • No-Mix Electronics Assembly
    • Extended Three-Week Pot Life
  • ABLESTIK 5074

    ABLESTIK 5074

    • Flexible Dissimilar-Material Bonding
    • Multiple Heat-Cure Options
    • Reworkable Non-Conductive Film
  • ABLESTIK 642-1

    ABLESTIK 642-1

    • Extended 8-Hour Assembly Window
    • Multiple Heat-Cure Schedules
    • Low-Outgassing Assembly Bonding
  • ABLESTIK 64C

    ABLESTIK 64C

    • Non-Silver Conductive Bonding
    • Room-Temperature or Heat Cure
    • Seawater-Exposure Assembly Fit
  • ABLESTIK CE 3511PHV

    ABLESTIK CE 3511PHV

    • Extended Dispensing Pot Life
    • No-Bleed Conductive Placement
    • Fast Hot-Plate Cure Option
  • ABLESTIK FS163

    ABLESTIK FS163

    • Equal-Weight BIPAX Mixing
    • Room-Temperature or Heat Cure
    • Broad-Material Industrial Bonding
  • ABLESTIK G757HF-D

    ABLESTIK G757HF-D

    • Automotive Headlamp Lens Bonding
    • Thixotropic Sag-Resistant Placement
    • Flexible -40 to 150 deg C Operation
  • ABLESTIK ICP9000

    ABLESTIK ICP9000

    • Semi-Sintering Power Die Attach
    • Extended 16-Hour Work Life
    • Thermal and Electrical Attach Path
  • BONDERITE C-AK 319

    BONDERITE C-AK 319

    • Spray-or-Immersion Application Flexibility
    • Effective Across Wide Concentration Range
    • Multi-Metal Pre-Plating Surface Prep
  • BONDERITE C-AK 3878-LF-NC

    BONDERITE C-AK 3878-LF-NC

    • Chromate- and Chlorine-Free Formula
    • Vapor-Degreasing Fluid Replacement
    • Shop Soil and Cutting-Oil Removal
  • BONDERITE C-AK 4181-L

    BONDERITE C-AK 4181-L

    • Single-Step Rust and Corrosion Removal
    • Immersion, Electrolytic, or Ultrasonic Use
    • AMS-1379 Aerospace Specification Testing
  • BONDERITE C-AK 4338

    BONDERITE C-AK 4338

  • BONDERITE C-AK 5578-L

    BONDERITE C-AK 5578-L

    • Combined Cleaning and Titanium Etching
    • Pre-Bonding Surface Etch Preparation
    • Concentration-Controlled Process Flexibility
  • BONDERITE C-IC 4104

    BONDERITE C-IC 4104

    • Nitric Acid Descaling Enhancement
    • Multi-Alloy Pickling Compatibility
    • Alloy-Tailored Bath Formulation
  • BONDERITE C-MC 5884

    BONDERITE C-MC 5884

    • MIL-C-85704C Type I Qualification
    • GE and Pratt and Whitney Engine Listings
    • Ash-Free Water-Miscible Cleaning
  • BONDERITE C-SO 4460

    BONDERITE C-SO 4460

    • BMS 11-7G Wipe-Solvent Qualification
    • Rapid Residue-Free Evaporation
    • Multi-Metal Pretreatment Wiping
  • BONDERITE L-AD 42

    BONDERITE L-AD 42

    • Organosilicone Surfactant Foam Control
    • Free-Rinsing Low-Residue Chemistry
    • Polymer, Adhesive, and Latex Foam Control
  • BONDERITE L-GP-D148A

    BONDERITE L-GP-D148A

    • PTFE Dry-Film Lubricant Formation
    • Spray-Viscosity Thinning Compatibility
    • Room-Temperature Cure with Heat Acceleration
  • BONDERITE M-CR 120

    BONDERITE M-CR 120

    • Two-Step Aluminum Deoxidizing and Coating
    • Manual Brush-Applied Aluminum Treatment
    • Pre-Portioned Two-Component Kit Packaging
  • BONDERITE S-AD 103

    BONDERITE S-AD 103

    • Acid-Bath Corrosion Inhibition
    • Direct Liquid Addition to Acid Baths
    • Industrial Metal-Cleaning Bath Support
  • ECCOBOND LUX OGR146TUV

    ECCOBOND LUX OGR146TUV

    • UV and Shadow-Area Thermal Cure
    • Low-Refractive-Index Optical Bonding
    • Extended 91-Day Working Window
  • FREKOTE 710-LV

    FREKOTE 710-LV

    • Room-Temperature Semi-Permanent Release
    • High-Slip High-Gloss Finish
    • Controlled Two-Coat Application
  • FREKOTE PUR-100

    FREKOTE PUR-100

    • Water-Based Non-Flammable Release
    • Multiple Releases Per Application
    • Paint-Ready Molded Parts
  • LOCTITE 079

    LOCTITE 079

    • Serviceable Low-Strength Thread Locking
    • One-Part Anaerobic Application
    • Purple Visual Identification
  • LOCTITE 083

    LOCTITE 083

    • Medium-Strength Hand-Tool Removal
    • 8 N m Breakaway Torque
    • Controlled One-Part Application
  • LOCTITE 084

    LOCTITE 084

    • Low-Viscosity Thread Application
    • 6 N m Breakaway Torque
    • Medium-Strength Hand-Tool Removal
  • LOCTITE 087

    LOCTITE 087

    • High-Strength Coarse-Thread Retention
    • 11.3 to 28.3 N m Prevail Torque
    • One-Part Heat-Assisted Disassembly
  • LOCTITE 220

    LOCTITE 220

    • Wicking Preassembled Threadlocking
    • Low-Strength Hand-Tool Removal
    • UV-Visible Application Inspection
  • LOCTITE 222MS

    LOCTITE 222MS

    • Low-Migration Thixotropic Application
    • Easy Hand-Tool Disassembly
    • Small-Fastener Threadlocking Control
  • LOCTITE 2422

    LOCTITE 2422

    • High-Temperature Threadlocking Paste
    • Thixotropic Paste Application
    • Serviceable Medium-Strength Locking
  • LOCTITE 248

    LOCTITE 248

    • Clean Stick Application
    • Medium-Strength Metal Threadlocking
    • Active and Passive Metal Cure
  • LOCTITE 2620

    LOCTITE 2620

    • Elevated-Temperature Threadlocking Paste
    • Thixotropic Paste Placement
    • Medium-to-High Fastener Retention
  • LOCTITE 268

    LOCTITE 268

    • High-Strength Thread Retention
    • Self-Feeding Stick Control
    • Active and Passive Metal Cure
  • LOCTITE 2760

    LOCTITE 2760

    • Fast Anaerobic Cure
    • High-Strength Heavy-Duty Locking
    • Reduced Liquid Migration
  • LOCTITE 3092

    LOCTITE 3092

    • 5 mm Gap Filling
    • Non-Sag Vertical Bonding
    • Fast Instant Fixturing
  • LOCTITE 380

    LOCTITE 380

    • Rubber-Toughened Shock Resistance
    • Black Bondline Identification
    • Fast Multi-Substrate Fixturing
  • LOCTITE 4014

    LOCTITE 4014

    • Very-Low-Viscosity Precision Bonding
    • Fast Mixed-Material Fixturing
    • Heat-Conditioned Bond Strength
  • LOCTITE 408

    LOCTITE 408

    • Low-Odor Low-Blooming Bonding
    • Very-Low-Viscosity Joint Wetting
    • Rapid Porous-Material Fixturing
  • LOCTITE 420

    LOCTITE 420

    • Very-Low-Viscosity Capillary Bonding
    • Fast Close-Fitting Assembly
    • Broad Metal-Plastic-Rubber Bonding
  • LOCTITE 4210

    LOCTITE 4210

    • Elastomer-Toughened Impact Resistance
    • Low-Viscosity Thin-Gap Bonding
    • Fast Multi-Substrate Fixturing
  • LOCTITE 425

    LOCTITE 425

    • Fast Plated-Fastener Fixturing
    • Low-Strength Serviceable Retention
    • Pre- or Post-Applied Locking
  • LOCTITE 430

    LOCTITE 430

    • Low-Viscosity Metal Bonding
    • Fast Thin-Gap Fixturing
    • Broad Rubber-Plastic Compatibility
  • LOCTITE 4307

    LOCTITE 4307

    • Rapid UV Surface Cure
    • Humidity Secondary Cure
    • Fluorescent Application Inspection
  • LOCTITE 431

    LOCTITE 431

    • Medium-Viscosity Application Control
    • Rapid Multi-Material Bonding
    • Strong Shear-Oriented Performance
  • LOCTITE 435

    LOCTITE 435

    • Rubber-Toughened Peel Resistance
    • Low-Viscosity Rapid Bonding
    • Porous-Material Bonding Range
  • LOCTITE 438

    LOCTITE 438

    • Black Rubber-Toughened Bonding
    • Enhanced Shock and Peel Resistance
    • Low-Viscosity Multi-Material Assembly
  • LOCTITE 460

    LOCTITE 460

    • Low-Odor Low-Blooming Cure
    • Very Fast Porous-Substrate Fixturing
    • Low-Viscosity Vapor-Controlled Bonding
  • LOCTITE 493

    LOCTITE 493

    • Very-Low-Viscosity Capillary Bonding
    • Fast Metal-Focused Fixturing
    • Broad Rubber-Plastic Bonding
  • LOCTITE 542

    LOCTITE 542

    • Low-Viscosity Fine-Thread Sealing
    • Anaerobic One-Part Application
    • Medium-Strength Serviceable Retention
  • LOCTITE 571

    LOCTITE 571

    • Medium-Viscosity Tapered-Thread Sealing
    • Anaerobic One-Part Retention
    • Fluid-Exposure Strength Retention
  • LOCTITE 635

    LOCTITE 635

    • High-Strength Cylindrical Retention
    • Medium-Viscosity Application Control
    • Anaerobic One-Part Metal Cure
  • LOCTITE 641

    LOCTITE 641

    • Serviceable Medium-Strength Retention
    • Controlled Medium-Viscosity Flow
    • Anaerobic One-Part Metal Cure
  • LOCTITE 662

    LOCTITE 662

    • Anaerobic-and-UV Dual Cure
    • Fast Exposed-Bead Fixturing
    • High-Strength Cylindrical Retention
  • LOCTITE 713

    LOCTITE 713

    • Pre- or Post-Applied Activation
    • Rapid 30-Second Drying
    • Short Controlled On-Part Window
  • LOCTITE 8060

    LOCTITE 8060

    • High-Temperature Anti-Seize Protection
    • Controlled Stick Application
    • Measured Assembly Torque Behavior
  • LOCTITE 88

    LOCTITE 88

    • Organic Air-Release Performance
    • Multi-Resin Formulation Scope
    • Vacuum De-Airing Process Support
  • LOCTITE ECI1016

    LOCTITE ECI1016

    • High-Speed Rotary Screen Printing
    • Low-Resistance Silver Conductive Traces
    • Two-Minute Hot-Air Drying
  • LOCTITE EDAG 33RO65A

    LOCTITE EDAG 33RO65A

    • High-Speed Conductive Printing
    • Graphite-Polyimide Temperature Stability
    • Low-Resistance Printed Conductivity
  • LOCTITE HC9872.1

    LOCTITE HC 9872.1

    • Low-density syntactic core costruction
    • Excellent moisture resistance
    • Compatible with 350°F epoxy prepregs
  • LOCTITE LB8017

    LOCTITE LB8017

    • Multi-Method Dry-Film Application
    • 400 deg C Sliding Service
    • 1315 deg C Anti-Seize Range
  • LOCTITE LB8504

    LOCTITE LB8504

    • Non-Metallic Conductive Anti-Seize
    • 482 deg C Operating Range
    • 0.13 Steel Fastener Torque Coefficient
  • LOCTITE NS5109

    LOCTITE NS5109

    • High-Temperature Flexible Sealing
    • High-Pressure Sealing up to 34 MPa
    • One-Part No-Mix Application
  • LOCTITE PC6231

    LOCTITE PC6231

    • Rapid 90-Minute Full Cure
    • Self-Leveling Low-Viscosity Fill
    • 10-15% Joint Movement Capability
  • LOCTITE SF7070

    LOCTITE SF7070

    • Low-Viscosity Precision Cleaning
    • 5-20 Minute Drying Window
    • Spray, Wipe, or Immersion Use
  • LOCTITE SF7471

    LOCTITE SF7471

    • Fast 30-70 Second Drying
    • Low-Temperature Cure Acceleration
    • Seven-Day On-Part Life
  • LOCTITE SF7649

    LOCTITE SF7649

    • Thirty-Day On-Part Life
    • Low-Temperature Cure Acceleration
    • Brush, Spray, or Pre-Applied Use
  • LOCTITE UK2073

    LOCTITE UK2073

    • Low-Energy Plastic Bonding
    • Nominal 2:1 Meter-Mix Processing
    • Elastic 300% Elongation
  • LOCTITE UK2173

    LOCTITE UK2173

    • Low-Energy Plastic Bonding
    • Nominal 2:1 Meter-Mix Processing
    • Elastic 300% Elongation
  • LOCTITE UK3173

    LOCTITE UK3173

    • Low-Viscosity Resin Handling
    • 45-Minute System Work Time
    • Flame-Retardant Potting System
  • LOCTITE UK3184

    LOCTITE UK3184

    • UK 3173 System Hardener
    • 45-Minute System Work Time
    • 24-Hour Room-Temperature Cure
  • LOCTITE UK3364

    LOCTITE UK3364

    • 60-120 Second Gel Time
    • 1:2 Volume Mix Ratio
    • Rigid Fiber-Optic Encapsulation
  • Loctite Ablestik 8008HT
    No longer available

    LOCTITE ABLESTIK 8008HT

    • Thermally conductive
    • Low modulus
    • Stencil printing
  • LOCTITE ABLESTIK ATB 120U

    LOCTITE ABLESTIK ATB 120U

    • Non conductive
    • Thin bondline
    • Fast cure
  • Loctite Stycast OA4000

    LOCTITE STYCAST OA4000

    • LED Encapsulation
    • Moisture resistant
    • Excellent thermal shock properties
  • LOCTITE 3217

    LOCTITE 3217

    • UV & Heat Cure
    • Non Conductive
    • Image sensor module assemblies
  • LOCTITE ABLESTIK 56C

    LOCTITE ABLESTIK 56C

    • High bond strength
    • Very low temperature cure
    • Passes NASA ougassing
  • LOCTITE ABLESTIK EMI 3620FA

    LOCTITE ABLESTIK EMI 3620FA

    • Compartment EMI Shielding
    • No popcorning and delamination
    • For gap, hole and trench filling
  • LOCTITE ABLESTIK 2000

    LOCTITE ABLESTIK 2000

    • Fast cure with no voids
    • Minimal resin bleed
    • Ultra low moisture absorption
  • LOCTITE ABLESTIK 561

    LOCTITE ABLESTIK 561

    • Amber epoxy film
    • Flexible & Reworkable
    • Thermally conductive
  • Loctite Stycast OB4000

    LOCTITE STYCAST OB4000

    • LED Encapsulation
    • Moisture resistant
    • Excellent thermal shock properties
  • LOCTITE ABLESTIK ATB F125E

    LOCTITE ABLESTIK ATB F125E

    • 25um
    • Non conductive
    • Meets thin wafer requirements
  • Loctite Ablestik 8008MD

    Loctite Ablestik 8008MD

    • Thermally conductive
    • Electrically conductive
    • Stencil printing
  • LOCTITE 3616

    LOCTITE 3616

    • One component
    • High wet strength
    • SMD to PCB adhesive
  • LOCTITE ABLESTIK 561K

    LOCTITE ABLESTIK 561K

    • Reworkable
    • Flexible
    • Thermally conductive
  • LOCTITE ABLESTIK 84-1LMINB1

    LOCTITE ABLESTIK 84-1LMINB1

    • Electrically conductive
    • Long work life
    • Bonds to difficult to wet surfaces
  • LOCTITE ABLESTIK EMI 8660S

    LOCTITE ABLESTIK EMI 8660S

    • Conformal EMI shielding
    • Excellent adhesion on EMC, Au, Ag
    • Spray, Print, Dispense
  • LOCTITE ABLESTIK 2000B

    LOCTITE ABLESTIK 2000B

    • Pb free applications
    • High hot/wet adhesion
    • Ultra low moisture absorption
  • ECCOBOND 3593

    ECCOBOND 3593

    • High-Elongation Cured Material
    • High-Adhesion Cured Material
  • Loctite Ablestik 2025D

    LOCTITE ABLESTIK 2025D

    • Excellent dispense capabilities
    • For mother die in array packaging
    • 260ºC reflow capability for Pb-free applications
  • LOCTITE STYCAST SC3613

    LOCTITE STYCAST SC3613

    • Elastomeric
    • Optically clear
    • Low viscosity
  • LOCTITE 3621

    LOCTITE 3621

    • One component
    • Chipbonder
    • Very High dispense speed
  • LOCTITE ABLESTIK 563K

    LOCTITE ABLESTIK 563K

    • Good heat transfer
    • Low squeeze out
    • Thermally conductive
  • LOCTITE ABLESTIK 2902

    LOCTITE ABLESTIK 2902

    • Electrically conductive
    • Thermally conductive
    • Ceramic, metal, glass and plastic substrates
  • Loctite Ablestik ATB F125E
    No longer available

    LOCTITE ABLESTIK ATB F150E

    • 50um
    • Non Conductive
    • Wafer lamination and Chip on chip
  • LOCTITE ABLESTIK BSP 125

    LOCTITE ABLESTIK BSP 125

    • Reworkable
    • Laser Markable
    • MSL 1 for WLCSP
  • LOCTITE 3703

    LOCTITE 3703

    • UV & Visible light Cure
    • High speed curing
    • Replaced by DSP 190024
  • LOCTITE ABLESTIK 3880

    LOCTITE ABLESTIK 3880

    • One component
    • Thermally and Electrically conductive
    • SMD bonding
  • LOCTITE ECI1010 E&C

    LOCTITE ECI1010 E&C

    • Flexible
    • High conductivity
    • PET substrates
  • LOCTITE ABLESTIK 2025DSI
    No longer available

    LOCTITE ABLESTIK 2025DSI

    • With Spacers
    • For mother die in array packaging
    • 260ºC reflow capability for Pb-free applications
  • LOCTITE ABLESTIK CDF 200

    LOCTITE ABLESTIK CDF 200

    • High MSL reliability
    • No resin bleed out
    • 15um and 30um
  • Loctite Ablestik 2030SC

    LOCTITE ABLESTIK 2030SC

    • Low warpage
    • Snap cure
    • Low stress
  • LOCTITE 3508NH
    No longer available

    LOCTITE 3508NH

    • Reworkable
    • Reflow curable
    • Improves mechanical reliability
  • LOCTITE ABLESTIK 566K

    LOCTITE ABLESTIK 566K

    • Extremely flexible film
    • Bond disimilar materials
    • Thermally conductive
  • LOCTITE ECI1011 E&C

    LOCTITE ECI1011 E&C

    • Highly Conductive Ink
    • Screen and Flexo printable
    • Paper and PET substrates
  • LOCTITE ABLESTIK 3888

    LOCTITE ABLESTIK 3888

    • Repair kit
    • Two component silver epoxy
    • Repair/Rework interconnections
  • LOCTITE 3875

    LOCTITE 3875

    • Two components
    • Thermally conductive
    • For transistors, rectifiers and power devices
  • LOCTITE ABLESTIK CDF 515P

    LOCTITE ABLESTIK CDF 515P

    • Electrically conductive
    • Thermally conductive
    • QFN, TQFP, eTQFP
  • Loctite Ablestik 2030SCM

    LOCTITE ABLESTIK 2030SCM

    • Low in Halogen content
    • Snap curable
    • Complies with IPC/JEDEC
  • LOCTITE AA 3106

    LOCTITE AA 3106

    • Transparent liquid
    • UV & Visible light cure
    • Enhances shock absorption
  • LOCTITE ABLESTIK 50298
    No longer available

    LOCTITE ABLESTIK 50298

    • Two components
    • Nickel filled
    • Alternative to Silver filled
  • LOCTITE EDAG 461SS E&C

    LOCTITE EDAG 461SS E&C

    • Conductive
    • Screen printable
    • Dries at low temperatures
  • LOCTITE ABLESTIK CDF 530P

    LOCTITE ABLESTIK CDF 530P

    • Electrically conductive
    • Thermally conductive
    • QFN, TQFP, eTQFP
  • LOCTITE 3515

    LOCTITE 3515

    • Cornerbond
    • Fast cure
    • Self alignment of SMT components
  • LOCTITE ABLESTIK 2033SC

    LOCTITE ABLESTIK 2033SC

    • Low cure temperature
    • Legacy smartcard product
    • Optimized rheology
  • Loctite Ablestik ABP 2032S

    LOCTITE ABLESTIK ABP 2032S

    • Low temperature cure
    • Good adhesion
    • Electrically conductive
  • LOCTITE ABLESTIK CDF 625

    LOCTITE ABLESTIK CDF 625P

    • Electrically conductive
    • Thermally conductive
    • Low warpage
  • LOCTITE ABLESTIK 5020

    LOCTITE ABLESTIK 5020

    • Non conductive film
    • Assembly applications
    • High purity
  • LOCTITE AA3526

    LOCTITE AA 3526

    • Translucent
    • Cures rapidly
    • Excellent adhesion to glass, plastics and metals
  • LOCTITE EDAG 7019 E&C

    LOCTITE EDAG 7019 E&C

    • Flexible
    • Good adhesion
    • Medical grade
  • Loctite Ablestik 2035SC

    LOCTITE ABLESTIK 2035SC

    • Low cure temperature
    • Smart card applications
    • Fast cure
  • LOCTITE ABLESTIK 2332

    LOCTITE ABLESTIK 2332

    • One component
    • Excellent adhesion
    • High strength
  • LOCTITE 3517M

    LOCTITE 3517M

    • Reworkable
    • No filler
    • Low halogen content
  • LOCTITE EDAG 725A(6S54) E&C

    LOCTITE EDAG 725A(6S54) E&C

    • Print Conductive circuits
    • No thinning required
    • Excellent adhesion
  • LOCTITE ABLESTIK CDF 815P
    No longer available

    LOCTITE ABLESTIK CDF 815P

    • Electrically conductive
    • Thermally conductive
    • QFN, SOIC, SO
  • LOCTITE ECCOBOND LUX A4035T

    LOCTITE ECCOBOND LUX A4035T

    • Photocurable
    • Pale yellow
    • Photodiode and Optical fiber terminations
  • LOCTITE ABLESTIK ABP2034

    LOCTITE ABLESTIK ABP2034

    • Ultra low modulus
    • High adhesion
    • Low temperature cure
  • Loctite Ablestik 2053S

    LOCTITE ABLESTIK 2053S

    • Low stress
    • Non Conductive
    • Use in Array packaging
  • Loctite Ablestik ACP 3122
    No longer available

    LOCTITE ABLESTIK ACP 3122

    • Conductive only in z axis
    • Anisotropic electrically conductive
    • Low temperature cure
  • Conductive assembly film

    LOCTITE ABLESTIK 5025E

    • Thin, uniform bondline control
    • Electrically conductive in x,y,z axes
    • Excellent electrical and thermal conductivity
  • LOCTITE ABLESTIK 45 CLEAR

    LOCTITE ABLESTIK 45 CLEAR

    • Clear Ablestik 45
    • Unfilled
    • Adjustable flexibility
  • LOCTITE 3536

    LOCTITE 3536

    • Reworkable Epoxy Underfill
    • Rapid Low-Temperature Cure
    • Low-Thermal-Stress Underfill Material
  • Loctite Ablestik CA 3556HF

    LOCTITE ABLESTIK CA 3556HF

    • Fast cure
    • Noble metal surfaces
    • Dispensing processes
  • LOCTITE ABLESTIK 2100A

    LOCTITE ABLESTIK 2100A

    • Fast cure
    • High hot/wet adhesion
    • Ultra low moisture absorption
  • LOCTITE ABLESTIK CF3350

    LOCTITE ABLESTIK CF3350

    • Uniform bondline
    • Even heat dissipation
    • Passes NASA ougassing
  • LOCTITE EDAG AV458 E&C
    No longer available

    LOCTITE EDAG AV458 E&C

    • Conductive
    • Compatible with PC and Polyester
    • Good flexibility
  • LOCTITE 3549

    LOCTITE 3549

    • Reworkable Underfill Material
    • Fast Flow Underfill Material
    • Low Temperature Cure
  • Loctite Ablestik CE3103WLV

    LOCTITE ABLESTIK CE3103WLV

    • Pb Free alternative to solder
    • Compatible with non noble metals
    • Optimized for dispensing
  • LOCTITE EDAG 7019 E&C
    No longer available

    LOCTITE EDAG PD 056 E&C

    • Flexible coating
    • Infrared cure
    • High speed rotogravure
  • LOCTITE 3563

    LOCTITE 3563

    • Rapid Heat Cure
    • Fast Flow Capillary Action
    • Low Moisture Uptake
  • LOCTITE ABLESTIK CE3104WXL

    LOCTITE ABLESTIK CE3104WXL

    • Pb Free alternative to solder
    • Electrically conductive
    • Optimized for printing
  • LOCTITE EDAG PF 021 E&C
    No longer available

    LOCTITE EDAG PF 021 E&C

    • Encapsulating Photopolymer
    • Prevents Silver migration
    • Fast UV Cure
  • LOCTITE ABLESTIK ECF 564A

    LOCTITE ABLESTIK ECF 564A

    • Electrically conductive
    • Excellent thermal conductivity
    • Passes Mil 5011 and NASA outgassing
  • LOCTITE ABLESTIK NCF 218
    No longer available

    LOCTITE ABLESTIK NCF 218

    • Non conductive Underfill film
    • Enables fine pitch, narrow gap Cu pillar
    • TSV, Die to die & Die to substrate
  • LOCTITE EDAG PF 407A E&C

    LOCTITE EDAG PF 407A E&C

    • Print Contact areas
    • Good screen residence time
    • Carbon filled
  • LOCTITE ABLESTIK ECF 564AHF

    LOCTITE ABLESTIK ECF 564AHF

    • High flow version of 564A
    • Excellent thermal conductivity
    • Passes Mil 5011 and NASA outgassing
  • LOCTITE ABLESTIK CE3520-3

    LOCTITE ABLESTIK CE3520-3

    • Nickel filled
    • For mismatched CTE
    • Basic conductivity
  • EUREMELT 2888

    EUREMELT 2888

    • Low Melt Viscosity
    • Rapid One-to-Three-Second Setting
    • Plastics and Porous Substrates
  • Loctite Ablestik 3230

    LOCTITE ABLESTIK 3230

    • Improved JEDEC performance
    • Fast cure
    • Excellent adhesion to copper
  • LOCTITE ABLESTIK CE3920

    LOCTITE ABLESTIK CE3920

    • Lid attach
    • Pb free alternative to Solder
    • Stencil Printable
  • LOCTITE ABLESTIK 724-14C

    LOCTITE ABLESTIK 724-14C

    • Polyurethane
    • Room temperature cure
    • Works in cryogenic conditions
  • LOCTITE EDAG PF 407C E&C

    LOCTITE EDAG PF 407C E&C

    • Screen printable
    • Extended screen residence time
    • Carbon filled
  • LOCTITE ABLESTIK NCF 234

    LOCTITE ABLESTIK NCF 234

    • Non-conductive Underfill Film
    • Enable fine pitch, narrow gap Cu Pillar
    • Pb-free & low κ
  • LOCTITE ABLESTIK 6202C-X

    LOCTITE ABLESTIK 6202C-X

    • Lage die sizes
    • Low flow (less than 150μm)
    • Low moisture uptake
  • LOCTITE ECCOBOND E1216M

    LOCTITE ECCOBOND E 1216M

    • Snap Cure
    • Non anhydride curing chemistry
    • Excellent adhesion and strength
  • LOCTITE ABLESTIK A329-1

    LOCTITE ABLESTIK A329-1

    • Class F (155°C)
    • Insulating applications
    • Resistance to water, freon, solvents etc
  • LOCTITE ABLESTIK CE8500

    LOCTITE ABLESTIK CE8500

    • Flexible
    • Low stress
    • Bond mismatched substrates
  • LOCTITE EDAG PF 410 E&C

    LOCTITE EDAG PF 410 E&C

    • Screen printable
    • Excellent print definition
    • Silver filled
  • LOCTITE TC4

    LOCTITE TC4

    • Thermally Conductive Lubrication
    • High Insulation Resistance
    • High Dielectric Strength
  • Loctite Ablestik 3230
    No longer available

    LOCTITE ABLESTIK 71-1

    • High bond strength
    • High purity
    • Electrically conductive
  • Loctite Eccobond 50300HT

    LOCTITE ECCOBOND E1172A

    • Void free Underfill
    • Fast cure at low temperature
    • Long pot life
  • LOCTITE EDAG PF 455B E&C

    LOCTITE EDAG PF 455B E&C

    • Non conductive
    • Dielectric crossover
    • Fast UV Cure
  • LOCTITE ABLESTIK E3517

    LOCTITE ABLESTIK E3517

    • Sealant
    • Low viscosity
    • High resistance to heat
  • LOCTITE TC8M

    LOCTITE TC8M

    • High Thermal-Conductivity Silicone Grease
    • Electrical-Insulation Thermal Grease
    • Corrosion-Protective Thermal Grease
  • LOCTITE ECCOBOND FP4502
    No longer available

    LOCTITE ECCOBOND FP4502

    • One component
    • Low CTE
    • No-clean flux compatible
  • LOCTITE ABLESTIK G500

    LOCTITE ABLESTIK G500

    • One component
    • General purpose
    • Sag resistant
  • LOCTITE EDAG PF 455BC E&C

    LOCTITE EDAG PF 455BC E&C

    • Good dielectric strength
    • Excellent printability
    • Fast UV Cure
  • LOCTITE ABLESTIK 71-1N
    No longer available

    LOCTITE ABLESTIK 71-1N

    • Degassed 71-1
    • Polyimide resin
    • High adhesion
  • LOCTITE ABLESTIK ICP 2120

    LOCTITE ABLESTIK ICP 2120

    • CCM bracket grounding
    • 50°C Cure temp
    • High thermal conductivity
  • LOCTITE ECCOBOND FP4526

    LOCTITE ECCOBOND FP4526

    • Low viscosity
    • Excellent wettability
    • Hi-Pb and Pb-free applications
  • LOCTITE ABLESTIK NCA 2286

    LOCTITE ABLESTIK NCA 2286

    • Dual Cure
    • High elongation strength
    • Active alignment in lens holder attach
  • LOCTITE EDAG PM 406V1 E&C

    LOCTITE EDAG PM 406V1 E&C

    • High conductivity
    • High solids content
    • Hot air dry cure
  • LOCTITE ABLESTIK ICP 3510

    LOCTITE ABLESTIK ICP 3510

    • Component assembly
    • Cost effective
    • Silver plated Cu filler
  • LOCTITE ABLESTIK TE3530

    LOCTITE ABLESTIK TE3530

    • One component
    • Thermally conductive
    • Low viscosity
  • LOCTITE ABLESTIK 285 CAT 11

    LOCTITE ABLESTIK 285 CAT

    • Thermally conductive
    • Non-sag
    • Resin versatility
  • LOCTITE ABLESTIK ICP 3535M2
    No longer available

    LOCTITE ABLESTIK ICP 3535M2

    • Adhesion stability
    • Pb free alternative to solder
    • Excellent for Sn terminated components
  • LOCTITE ECCOBOND FP4527

    LOCTITE ECCOBOND FP4527

    • Low viscosity
    • High flow
    • Excellent wettability
  • LOCTITE ABLESTIK 789-3

    LOCTITE ABLESTIK 789-3

    • Non conductive
    • Good moisture resistance
    • Substrate attach
  • LOCTITE ECCOBOND FP4530

    LOCTITE ECCOBOND FP4530

    • Fast flow
    • Small gap sizes
    • Snap cure
  • LOCTITE ABLESTIK ICP 4000

    LOCTITE ABLESTIK ICP 4000

    • High temperature performance
    • Excellent electrical conductivity
    • Flexible and low stress
  • LOCTITE DSP 190024

    LOCTITE DSP 190024

    • UV Cure
    • Bone white translucent
    • Sealant for displays
  • LOCTITE ABLESTIK 8-2

    LOCTITE ABLESTIK 8-2

    • Thermally conductive
    • Positive under UV light
    • For MEMs packages
  • Loctite Eccobond FP4531

    LOCTITE ECCOBOND FP4531

    • Snap cure
    • Fast flow
    • Passes NASA outgassing
  • Loctite Ablestik ICP 4001

    LOCTITE ABLESTIK ICP 4001

    • Low outgassing
    • Low stress interconnects
    • Noble components on noble LF
  • LOCTITE ABLESTIK 8006NS

    LOCTITE ABLESTIK 8006NS

    • B-stageable
    • Smaller die sizes
    • Improved printability
  • LOCTITE 3217

    LOCTITE ECCOBOND 3707

    • UV & Heat cure
    • One component
    • BGA cornerbond
  • LOCTITE STYCAST EFF 15

    LOCTITE STYCAST EFF 15

    • Excellent dielectric properties
    • Low stress
    • Low shrinkage
  • LOCTITE 3103

    LOCTITE AA 3103

    • UV/Visible-Light Adhesive Cure
    • High-Adhesion Adhesive Bonding
    • Polycarbonate Bonding Application
  • LOCTITE ABLESTIK ICP 4015

    LOCTITE ABLESTIK ICP 4015

    • One component
    • High flexibility
    • Low temperature cure
  • LOCTITE HHD 3607BK

    LOCTITE HHD 3607BK

    • Jettable PUR
    • Moisture cure
    • High adhesion strength
  • LOCTITE ABLESTIK 8175

    LOCTITE ABLESTIK 8175

    • Stress absorbing
    • Pb free Solder replacement
    • Stencil or Screen printable
  • LOCTITE ECCOBOND FP4545FC

    LOCTITE ECCOBOND FP4545FC

    • High purity
    • Rigid, low stress seal
    • Good toughness
  • LOCTITE STYCAST US 2350

    LOCTITE STYCAST US 2350

    • Flame retardent
    • Low CTE
    • Room temperature curing
  • LOCTITE 3104

    LOCTITE 3104

    • UV/Visible-Light Adhesive Cure
    • Direct PVC-to-Polycarbonate Bonding
    • Low-Viscosity Adhesive Application
  • LOCTITE SF 7360

    LOCTITE SF 7360

    • Low odor
    • Stencil and Nozzle cleaner
    • Compatible with epoxy adhesives
  • LOCTITE ABLESTIK ICP 8118

    LOCTITE ABLESTIK ICP 8118

    • Snap cure
    • Excellent flexibility
    • High speed dispensing
  • LOCTITE ECCOBOND FP4547

    LOCTITE ECCOBOND FP4547

    • Enhanced adhesion
    • Rigid, low stress seal
    • High purity
  • LOCTITE 3211

    LOCTITE 3211

    • UV/Visible-Light Cure Activation
    • Fast Adhesive Cure
    • Low-Viscosity Adhesive Application
  • LOCTITE ABLESTIK ICP 8282

    LOCTITE ABLESTIK ICP 8282

    • Snap cure
    • High flexibility
    • High speed print
  • LOCTITE ABLESTIK 8200T

    LOCTITE ABLESTIK 8200T

    • High electrical conductivity
    • Snap curable
    • Excellent adhesion to Ag plated LF
  • LOCTITE ECCOBOND FP4549

    LOCTITE ECCOBOND FP4549

    • Extends thermal cycling performance
    • Rigid, low stress
    • High purity
  • LOCTITE 383

    LOCTITE 383

    • High-Viscosity Placement Control
    • 0.602 W/(m K) Thermal Bonding
    • One-Component Thermal Bonding System
  • LOCTITE ECCOBOND FP5201

    LOCTITE ECCOBOND FP5201

    • High purity
    • BMI/Acrylate
    • One component
  • LOCTITE ABLESTIK 8200TI

    LOCTITE ABLESTIK 8200TI

    • High electrical conductivity
    • Snap curable
    • Excellent adhesion to Ni/Pd/Au
  • LOCTITE ABLESTIK ICP 8311

    LOCTITE ABLESTIK ICP 8311

    • Snap curable
    • Sn Compatible
    • Jet Dispensing & Stenci printing
  • LOCTITE 384

    LOCTITE 384

    • 0.757 W/(m K) Thermal Conductivity
    • Room-Temperature Activator Cure
    • Controlled Medium-Strength Bonding
  • Loctite Ablestik 8290

    LOCTITE ABLESTIK 8290

    • Low bleed
    • Low stress
    • Improved JEDEC performance
  • Loctite Eccobond NCP5209

    LOCTITE ECCOBOND NCP5209

    • Non conductive
    • Excellent protection of electrical joints
    • Small assembly gaps and tight pitches
  • LOCTITE ABLESTIK SI 5421

    LOCTITE SI 5421

    • Room temperature cure
    • Low stress
    • EMI Shielding gasketing material
  • LOCTITE 4031

    LOCTITE 4031

    • Low-Odor Cyanoacrylate Adhesive
    • Low-Blooming Adhesive Cure
    • Medical-Device Bonding Applications
  • Loctite Eccobond UF 1173

    LOCTITE ECCOBOND UF 1173

    • One component
    • Low CTE
    • Automotive grade
  • LOCTITE ABLESTIK 8301S1

    LOCTITE ABLESTIK 8301 S1

    • Snap cure
    • Hot die shear strength
    • Improved JEDEC performance
  • Loctite SI 5970 - Gasketing Sealant

    Loctite SI 5970 - Gasketing Sealant

    • One-Component Thixotropic RTV Silicone
    • 25-Minute Tack-Free Time
    • Oil-Resistant Sheet-Metal Gasketing
  • LOCTITE 4306

    LOCTITE 4306

    • Dual-Cure Bonding Processing
    • Low-Blooming Bonding Cure
    • Rapid Surface and Fixture Curing
  • Loctite Ablestik 8302

    LOCTITE ABLESTIK 8302

    • Excellent peel strength
    • Low moisture absorption
    • Improved JEDEC performance
  • LOCTITE ECCOBOND UF 1175

    LOCTITE ECCOBOND UF 1175

    • White
    • Low CTE
    • Easy dispensability
  • LOCTITE 4311

    LOCTITE 4311

    • ISO 10993-Based Biocompatible
    • Low-Blooming Bonding Cure
    • Dual-Cure Bonding Processing
  • Loctite Ablestik 8302
    No longer available

    LOCTITE ABLESTIK 8322A

    • Minimal resin bleed
    • Large device bonding
    • Accurate bondline control
  • LOCTITE ECCOBOND UF 3578

    LOCTITE ECCOBOND UF 3578

    • Fast heat-cure adhesive designed for underfill and fixture applications
    • Thixotropic and fluorescent for controlled flow and optical inspection
    • Reflow-compatible for SMT processes
  • LOCTITE 414

    LOCTITE 414

    • Low-Viscosity General Bonding
    • Fast Rubber and Plastic Fixturing
    • Strong Thin-Gap Metal Bonds
  • LOCTITE ECCOBOND UF 3810

    LOCTITE ECCOBOND UF 3810

    • High Tg
    • Halogen free
    • Reworkable
  • LOCTITE ABLESTIK 8360

    LOCTITE ABLESTIK 8360

    • Excellent dispensability
    • Miinimal resin bleed
    • Minimal tailing and stringing
  • LOCTITE 4314

    LOCTITE 4314

    • One-Component Adhesive System
    • Dual-Cure Bonding Processing
    • Low-Blooming Bonding Cure
  • Reworkable underfill examples

    LOCTITE ECCOBOND UF 3811

    • Reworkable
    • Room temperature flow
    • Low viscosity
  • LOCTITE ABLESTIK 8361J

    LOCTITE ABLESTIK 8361J

    • Excellent dispensability
    • 1mil Spacers
    • Minimal voiding
  • LOCTITE 4861

    LOCTITE 4861

    • Flexible Cured Adhesive
    • Rapid Humidity Cure
    • Medium-Viscosity Application Control
  • LOCTITE TCP7000

    LOCTITE TCP7000

    • Stencil-Printable Phase-Change Layer
    • No Pump-Out or Dry-Out
    • Reworkable Silicone-Free Interface
  • LOCTITE ECCOBOND UF 3812

    LOCTITE ECCOBOND UF 3812

    • Halogen free
    • Room temperature flow
    • One component
  • LOCTITE ABLESTIK 8370

    LOCTITE ABLESTIK 8370

    • Gold Filled
    • High electrical conductivity
    • Works on Noble finished substrates
  • LOCTITE 518

    LOCTITE 518

    • Anaerobic Thread Sealing
    • Gap-Filling Sealant Formulation
    • Thixotropic Application Control
  • LOCTITE AA 3035

    LOCTITE AA 3035

    • Low Energy Plastic Bonding
    • Fast Room-Temperature Bonding Cure
    • Multi-Substrate Durability Acrylic Bonding
  • LOCTITE EIF1000

    LOCTITE EIF1000

    • Phase-Change Surface Conformability
    • Kapton-Based Electrical Isolation
    • Residue-Free Pad Replacement
  • Loctite Ablestik 8387B

    LOCTITE ABLESTIK 8387B

    • Fast cure
    • Aerospace applications
    • Glass attach for 3d sensors
  • BERGQUIST SIL PAD TSP 1600S

    BERGQUIST SIL PAD TSP 1600S

    • 0.61 deg C in^2/W Thermal Impedance
    • Electrical-Insulation Thermal Interface
    • Compliant Fiberglass-Reinforced Low-Pressure Thermal Pad
  • LOCTITE 5188

    LOCTITE 5188

    • Flexible Cured Sealing
    • Strong Aluminum Adhesion
    • High-Viscosity Placement Control
  • LOCTITE AA 325

    LOCTITE AA 325

    • One-Component Adhesive System
    • Rigid-Part Structural Bonding
    • Gap and Fluid Resistance
  • LOCTITE ABLESTIK 8387B

    LOCTITE ABLESTIK 8387BM

    • Fast cure
    • 2 in 1
    • Die attach and Glob top
  • BONDERITE C-AD-ETCH

    BONDERITE C-AD-ETCH

    • Smooth Aluminum Etching for Anodizing
    • Adjustable Etch-Factor Additive Concentration
    • Concentrated Sodium-Hydroxide Etchant Additive
  • LOCTITE SI 587

    LOCTITE SI 587

    • 250 to 600 g/min Extrusion
    • 10 to 50 Minute Tack-Free
    • At Least 350% Cured Elongation
  • LOCTITE AA 330

    LOCTITE AA 330

    • Multi-Material Urethane Bonding
    • One-Component Application Urethane Bonding
    • High-Strength Structural Bonding
  • BERGQUIST TGF 3600

    BERGQUIST TGF 3600

    • 3.6 W/m-K Thermal Conductivity
    • Sixty-Minute Application Window
    • Soft Conforming Gap Fill
  • LOCTITE TCF1000

    LOCTITE TCF1000

    • Pressure-Responsive Thermal Impedance
    • Reworkable Residue-Free Removal
    • Silicone-Free Phase-Change Interface
  • Loctite Ablestik ABP 8420

    LOCTITE ABLESTIK 8387BS

    • Non conductive
    • Contains spacers
    • Black pigmentation
  • BONDERITE M-CR 1132 AERO TOUCH-N-PREP PEN

    BONDERITE M-CR 1132 AERO TOUCH-N-PREP PEN

    • Ready-to-Use Touch-N-Prep Pen
    • No-Rinse Dry-in-Place Processing
    • Modifiable Felt-Tip Applicator
  • LOCTITE SI 5900

    LOCTITE SI 5900

    • At Least 100-Second Blow-Out Resistance
    • At Most 0.2 mm ISO 7390 Flow
    • At Least 400% Cured Elongation
  • LOCTITE AA 3311

    LOCTITE AA 3311

    • High Speed Light Cure
    • Multi-Substrate Urethane Bonding
    • Medical Devices Urethane Bonding
  • LOCTITE SI 5033

    LOCTITE SI 5033

    • Dual-Cure Sealing Processing
    • Rapid Light Cure
    • Thixotropic Application Control
  • LOCTITE ABLESTIK 8388A

    LOCTITE ABLESTIK 8388A

    • Non conductive
    • Fast cure at low temperature
    • Excellent dispensability
  • LOCTITE ECCOBOND UF 8807

    LOCTITE ECCOBOND UF 8807

    • Cyanate Ester
    • Fast cure - Low temp
    • Superior adhesion after moisture testing
  • LOCTITE SI 5910

    LOCTITE SI 5910

    • High Movement Flange Sealing
    • Engine Oil Resistance
    • Thixotropic Application Control
  • LOCTITE AA 334

    LOCTITE AA 334

    • Permanent Acrylic Bonding
    • Tough Structural Bonding
    • Flexible Cured Adhesive
  • LOCTITE SI 5040

    LOCTITE SI 5040

    • One-Component Sealing System
    • Non-Corrosive Sealing Formulation
    • Self-Leveling Flowable Placement
  • BONDERITE M-CR 1200S

    BONDERITE M-CR 1200S

    • MIL-DTL-5541 Qualified Aluminum Coating
    • Immersion, Spray, or Brush Application Flexibility
    • Wide-Range Bath Operating Window
  • Loctite Ablestik 8302

    LOCTITE ABLESTIK 8390

    • Thermally conductive
    • Low condensable volatiles
    • Compatible with palladium
  • LOCTITE ECCOBOND UF 9000AE

    LOCTITE ECCOBOND UF 9000AE

    • Low die warpage
    • Best large die underfill
    • 260°C reflow capability for Pb- free, low-k applications
  • LOCTITE AA 3412

    LOCTITE AA 3412

    • High-Strength Structural Bonding
    • Non-Sag Placement Control
    • Fast Room Temperature Curing
  • LOCTITE SI 5015

    LOCTITE SI 5015

    • RTV Silicone Cure
    • Tough, Flexible Silicone Rubber
    • Broad Substrate Compatibility
  • LOCTITE SI 5699

    LOCTITE SI 5699

    • One-Component Oxime RTV Silicone
    • Non-Corrosive Flange Sealant
    • Rigid-Flange Sealing Applications
  • BONDERITE M-CR 1201

    BONDERITE M-CR 1201

    • MIL-DTL-81706 Brush-Application Approval
    • Ready-to-Use Without Titration or Adjustment
    • Integral Gold-to-Tan Aluminum Coating
  • Loctite Ablestik 84-1LMI

    LOCTITE ABLESTIK 84-1LMI

    • Low bleed
    • Low outgassing
    • Electrically conductive
  • LOCTITE ECCOBOND UF4550HTC

    LOCTITE ECCOBOND UF4550HTC

    • Thermally conductive
    • Low ionics
    • Alumina filled
  • BONDERITE M-CR 1500

    BONDERITE M-CR 1500

    • Transparent Chromate Conversion Coating
    • Immersion, Spray, or Brush Application
    • Documented MIL-DTL-81706/MIL-DTL-5541 Qualification
  • LOCTITE AA 3494

    LOCTITE AA 3494

    • UV/Visible-Light Adhesive Cure
    • 10-Second or Faster Fixture
    • Electrically Insulating Acrylic Adhesive
  • LOCTITE SI 5470

    LOCTITE SI 5470

    • Dual-Cure Sealing Processing
    • Low-Modulus Cured Sealing
    • Strong Plastic/Metal Adhesion
  • LOCTITE SI 593

    LOCTITE SI 593

    • Non-Slumping Sealant Formulation
    • Adhesion and Flexibility
    • Seals Out Moisture and Contaminants
  • Loctite Ablestik 84-1LMIS

    LOCTITE ABLESTIK 84-1LMIS

    • Long work life
    • Solvent free
    • Electrically conductive
  • BONDERITE M-CR 1600

    BONDERITE M-CR 1600

    • Hexavalent Chromate Conversion Coating
    • Immersion or Spray Processing
    • MIL-DTL-81706A/BAC 5719 Approval
  • LOCTITE AA 352

    LOCTITE AA 352

    • One-Component Adhesive System
    • Rapid UV Bonding Cure
    • Impact-Resistant Acrylic Bonding
  • LOCTITE SI 5920

    LOCTITE SI 5920

    • One-Component Sealing System
    • Non-Corrosive Sealing Formulation
    • Thixotropic Application Control
  • Loctite Eccobond UF8830S

    LOCTITE ECCOBOND UF8830S

    • High purity
    • Improved toughness
    • Good flow with self filleting
  • Loctite Ablestik 84-1LMISNB

    LOCTITE ABLESTIK 84-1LMISNB

    • Long work life
    • High purity
    • Electrically conductive
  • LOCTITE DA 100
    No longer available

    LOCTITE DA 100

    • Sn91.5/Sb8.5 - Pb free 92A Alloy
    • Semiconductor die attach
    • Excellent dispense capabilities
  • BONDERITE M-CR 600

    BONDERITE M-CR 600

    • Ready-to-Use Chromate Conversion Coating
    • Aluminum Corrosion Protection and Paint Adhesion
    • QPL-81706 Aerospace Qualification
  • LOCTITE AA 3525

    LOCTITE AA 3525

    • Rapid Cure Speed
    • Clear, Colorless Bondline
    • Good Moisture and Humidity Resistance
  • LOCTITE SI 596

    LOCTITE SI 596

    • Enhances Load Bearing
    • Reduced-Migration Sealing Formulation
    • Good Temperature Resistance
  • Loctite Ablestik 84-1LMISR4

    LOCTITE ABLESTIK 84-1LMISR4

    • Excellent dispense capabilities
    • Stencil printable
    • Bare Copper Substrate
  • LOCTITE GC 10
    No longer available

    LOCTITE GC 10

    • SAC 305 - No refrigeration
    • PCB Assembly
    • Stencil Printable
  • Loctite FP4804 | Epoxy Underfill

    LOCTITE FP4804 | Epoxy Underfill

    • Good flowability
    • Low CTE/modulus (reduced stress)
    • No resin bleed out on glass
  • BONDERITE M-CR 871

    BONDERITE M-CR 871

    • One-Part Dry-in-Place Conversion Coating
    • Corrosion Protection and Paint Adhesion
    • Touch-N-Prep Aerospace Repair Application
  • LOCTITE AA 3924

    LOCTITE AA 3924

    • Fast UV/Visible-Light Fixture
    • Sterilization-Resistant Cured Bondline
    • Medical-Device Assembly Bonding
  • LOCTITE GC 18
    No longer available

    LOCTITE GC 18

    • SAC 305 - No refrigeration
    • Low voiding
    • Stencil Printable
  • LOCTITE ABLESTIK 84-1LMIT

    LOCTITE ABLESTIK 84-1LMIT

    • Electrically conductive
    • High thermal conductivity
    • MIL 5011 - NASA
  • BONDERITE M-CR-T5900

    BONDERITE M-CR-T5900

    • Trivalent-Chromium Corrosion-Resistant Conversion Coating
    • MIL-DTL-81706/5541 Type II Qualification
    • Immersion or Pressure-Spray Processing
  • LOCTITE AA 3974

    LOCTITE AA 3974

    • Rapid UV/Visible-Light Fixture
    • Thermal-Cycling-Resistant Cured Adhesive
    • Potting/Sealing/Bonding Assembly Applications
  • LOCTITE GC 50
    No longer available

    LOCTITE GC 50

    • SAC 305 - No refrigeration
    • Low voiding
    • Fine nozzle Jet dispensing
  • LOCTITE ABLESTIK 84-1LMIT1

    LOCTITE ABLESTIK 84-1LMIT1

    • Electrically conductive
    • High thermal conductivity
    • Faster Screen printing
  • Loctite Ablestik 84-3

    LOCTITE ABLESTIK 84-3

    • Solvent-free
    • Aerospace applications
    • Bonds to multiple substrates
  • LOCTITE HF 212
    No longer available

    LOCTITE HF 212

    • 90ISC and 97SC Alloys
    • Halogen free
    • Stencil Printable
  • LOCTITE AA H3101

    LOCTITE AA H3101

    • 1:1 Controlled Mixing
    • 20 to 25-Minute Fixture Time
    • Up to 9.5 mm Gap Filling
  • LOCTITE ABLESTIK 84-3J

    LOCTITE ABLESTIK 84-3J

    • Bondline control
    • Box oven Cure
    • Non Conductive
  • LOCTITE AA H8000

    LOCTITE AA H8000

    • Fast Assembly Fixturing
    • Impact-Resistant Methacrylate Bonding
    • Minimal Surface Preparation Needed
  • Loctite Ablestik 84-3LV

    LOCTITE ABLESTIK 84-3LV

    • Solvent-free
    • Long work life
    • One component
  • LOCTITE LF 318
    No longer available

    LOCTITE LF 318

    • 90iSC Alloy
    • Automotive reliability qualified
    • Stencil Printable
  • Loctite STYCAST 2651-40W1

    Loctite STYCAST 2651-40W1

    • Epoxy Potting and Encapsulation Resin
    • Room-Temperature Encapsulation Cure
    • 0.5 W/(m K) Thermal Encapsulation
  • BONDERITE M-NT 5200

    BONDERITE M-NT 5200

    • Chrome-Free Nano-Ceramic Multi-Metal Pretreatment
    • Paint-Adhesion and Corrosion-Resistance Improvement
    • Phosphate-Free Spray-Line Pretreatment
  • Loctite STYCAST 3103

    Loctite STYCAST 3103

    • Low-Viscosity Solvent-Free Epoxy
    • Room-Temperature or Heat Cure
    • Electrically Insulating Epoxy
  • BONDERITE M-NT 5700

    BONDERITE M-NT 5700

    • Chromium-Free Ready-to-Use Aluminum Pretreatment
    • Corrosion-Resistant Paint-Adhesion Conversion Layer
    • Controlled Temperature-pH-Time Processing
  • Loctite Ablestik 843-1

    LOCTITE ABLESTIK 843-1

    • Solvent free
    • High purity
    • Screen printable
  • LOCTITE MSC-01
    No longer available

    LOCTITE MSC-01

    • Cleaner
    • Solder paste processes
    • Manual and automatic operations
  • Loctite 9432 NA Epoxy Adhesive

    Loctite 9432 NA Epoxy Adhesive

  • LOCTITE 1C

    LOCTITE 1C

    • Controlled Two-Part Mixing
    • Flexible Cure Scheduling
    • Machinable Cured Epoxy
  • Loctite 9696.060NW AERO

    Loctite 9696.060NW AERO

    • Metal-to-Aluminum Epoxy Bonding
    • 225 to 265 deg F Cure Window
    • 250 deg F Service Temperature
  • LOCTITE 5045

    LOCTITE 5045

    • Non-Slumping RTV Application
    • Flexible Shock-Absorbing Silicone
    • Strain-Relief Component Reinforcement
  • LOCTITE ABLESTIK 8600

    LOCTITE ABLESTIK 8600

    • Thermally conductive
    • Low bleed
    • Compatible for use with Ag, PPF and Cu
  • Loctite EA 9309.3NA AERO EPOXY PASTE ADHESIVE

    Loctite EA 9309.3NA AERO EPOXY PASTE ADHESIVE

    • High Aluminum Shear and Peel Strength
    • Glass-Bead Bondline Control
    • Humidity and Fluid Resistance
  • LOCTITE 5240

    LOCTITE 5240

    • Light-and-Moisture Dual Cure
    • Shear-Thinning Cavity Filling
    • Flexible Electrically Insulating Rubber
  • ABLESTIK 281

    ABLESTIK 281

    • Non-Sag Placement Control
    • 1 x 10^15 ohm-cm Volume Resistivity
    • 55 to 180 deg C Service Range
  • BONDERITE M-PT 99X

    BONDERITE M-PT 99X

    • Chromium/Phosphate-Free Reactive Resin Post-Treatment
    • Painted Steel/Zinc/Aluminum Corrosion Resistance
    • Ambient Spray or Immersion Application
  • LOCTITE ABLESTIK 8900NCM

    LOCTITE ABLESTIK 8900NCM

    • Low resin bleed
    • Non Conductive
    • No CAT3 CMR substances
  • ABLESTIK 931-1

    ABLESTIK 931-1

    • Low-Viscosity Fine-Gap Encapsulation
    • Low-Exotherm One-Step Casting Cure
    • 27.6 kV/mm Dielectric Strength
  • LOCTITE SI 5248

    LOCTITE SI 5248

    • UV/Shadow-Area Dual Cure
    • Thixotropic Low-Migration Sealing
    • Flexible Electrical Insulation
  • LOCTITE ABLESTIK 958-11

    LOCTITE ABLESTIK 958-11

    • Non conductive
    • Absorbs stress
    • Bonding of large ICs
  • LOCTITE SI 598

    LOCTITE SI 598

    • Wide-Temperature Automotive Gasketing
    • High-Elongation Cured Seal
    • Automotive Fluid-Resistant Gasketing
  • LOCTITE ABLESTIK 965-1F

    LOCTITE ABLESTIK 965-1F

    • Low modulus
    • Low contaminants
    • Low viscosity version of 965-1L
  • Loctite EA 937.7

    Loctite EA 9377

    • 2,000-Cycle Thermal-Crack Resistance
    • 124 MPa Compressive Strength
    • 5 mil Low-Slump Moldable Shim
  • LOCTITE SI-5970

    LOCTITE SI-5970

    • 25-Minute Tack-Free Time
    • Oil-Resistant Flexible Gasketing
    • One-Part No-Mix Application
  • LOCTITE ABLESTIK 965-1L

    LOCTITE ABLESTIK 965-1L

    • Stress absorbing
    • Low contaminants
    • For large dies
  • Loctite EA 9390 AERO

    Loctite EA 9390 AERO

    • Graphite- and Glass-Composite Repair
    • Hot/Wet Strength and High Shear Modulus
    • BMS 8-301 Heat-Cure Qualification
  • BONDERITE M-ZN 880

    BONDERITE M-ZN 880

    • Adhesion-Promoting Surface Treatment
    • Multi-Metal Spray/Immersion Pretreatment
    • Pre-Phosphate Corrosion-Resistance Improvement
  • Loctite EA 9392 AERO Epoxy Adhesive

    Loctite EA 9392 AERO Epoxy Adhesive

    • 1,000 psi Aluminum Lap Shear
    • Thixotropic Gap-Filling Control
    • 75-Minute Working Window
  • LOCTITE ABLESTIK 968-2

    LOCTITE ABLESTIK 968-2

    • Electrically insulating
    • Hybrid chemistry
    • Dispense and Stencil print
  • Loctite ABP 2030SCR

    LOCTITE ABLESTIK ABP 2030SCR

    • Low moisture uptake
    • Low stress
    • Solvent free
  • Loctite EA 9395 AERO EPOXY ADHESIVE

    Loctite EA 9395 AERO EPOXY ADHESIVE

    • 1,200 psi Lap Shear
    • Thixotropic Application Control
    • Ambient-Temperature Bonding Cure
  • Loctite Ablestik 2035SC

    LOCTITE ABLESTIK ABP 2035SCR

    • Low stress
    • Snap cure
    • Good dispense behavior
  • Loctite EA 9396

    Loctite EA 9396

    • Low Mixed Viscosity
    • 120-Minute Pot Life
    • MMM-A-132 Type 1 Class 3 Qualification
  • LOCTITE ABLESTIK ABP 6389

    LOCTITE ABLESTIK ABP 6389

    • High-reliability QFP manufacture
    • Low outgassing
    • Good adhesion to BSM & Non BSM die
  • Loctite EA 956 AERO EPOXY ADHESIVE

    Loctite EA 956 AERO EPOXY ADHESIVE

    • 1,000 psi Lap Shear
    • Room-Temperature or Accelerated Heat Cure
    • Low-Viscosity Adhesive Application
  • Fingerprint sensor bonding attach ABP 6892

    LOCTITE ABLESTIK ABP 6892

    • Designed for Fingerprint Sensors
    • Low stress for ultra thin glass
    • Low outgassing and finest filler
  • Loctite E-30CL EPOXY ADHESIVE

    Loctite E-30CL EPOXY ADHESIVE

    • Minimally Shrinking Epoxy Bondline
    • Two-Part Ambient-Cure Processing
    • Adhesion to Glass
  • LOCTITE ABLESTIK ABP 6892BA

    LOCTITE ABLESTIK ABP 6892BA

    • Designed for Fingerprint Sensors
    • Low stress for ultra thin glass
    • Low outgassing and filler free
  • LOCTITE ABLESTIK ABP 8035
    No longer available

    LOCTITE ABLESTIK ABP 8035

    • Heat cure
    • Transparent liquid
    • LED applications
  • LOCTITE ABLESTIK ABP 8035M

    LOCTITE ABLESTIK ABP 8035M

    • Clear Silicone
    • High modulus at high temp
    • For High brightness LED
  • LOCTITE ABLESTIK 12-1

    LOCTITE ABLESTIK 12-1

    • Thermally Conductive Bonding
    • Reworkable Bonding Material
    • Up to 200 deg C Service
  • Loctite Ablestik ABP8037TI

    LOCTITE ABLESTIK ABP 8037TI

    • High-reliability LED manufacture
    • High thermal conductivity
    • Small die on Au-finish LF
  • Loctite EA 9837.1 030OST AERO

    Loctite EA 9837.1 030OST AERO

    • Long-Open-Time Composite Surfacing
    • Fast 121/177 deg C Cure
    • High-Adhesion Composite Surface Film
  • LOCTITE ABLESTIK ABP 8060T

    LOCTITE ABLESTIK ABP 8060T

    • High heat transfer
    • Soft solder replacement
    • Stable at high temperatures
  • LOCTITE ABLESTIK ABP 8064T

    LOCTITE ABLESTIK ABP 8064T

    • Highest thermal conductivity
    • Soft solder replacement
    • Low outgassing
  • Loctite Ablestik ABP 8142B

    LOCTITE ABLESTIK ABP 8142B

    • Low and stable modulus
    • Snap cure or oven cure
    • MEMs package applications
  • Loctite Ablestik ABP 8420

    LOCTITE ABLESTIK ABP 8420

    • Fast cure - Low temp also possible
    • Excellent RBO performance
    • Lid attach - Optical sensors & 3d modules
  • Loctite EA 9360 AERO Epoxy Adhesive

    Loctite EA 9360 AERO Epoxy Adhesive

    • Toughened Structural Epoxy Bonding
    • 50-Minute Assembly Pot Life
    • Room-Temperature Aircraft Bonding Cure
  • LOCTITE ABLESTIK ABP 8910T

    LOCTITE ABLESTIK ABP 8910T

    • High MRT performance
    • High thermal conductivity
    • BMI Hybrid
  • EA 9628 060NW Aero

    EA 9628 060NW Aero

    • Toughened Structural Bonding
    • Knitted or Non-Woven Nylon Carrier
    • Lap-Shear, Peel, and Environmental Performance
  • LOCTITE ABLESTIK ABP 8920TC

    LOCTITE ABLESTIK ABP 8920TC

    • High MRT performance
    • High thermal conductivity
    • Controlled particle size
  • LOCTITE ABLESTIK ABP8303A

    LOCTITE ABLESTIK ABP8303A

    • High die shear strength
    • Low outgassing
    • Ideal for large die sizes
  • LOCTITE ABLESTIK DX20C
    No longer available

    LOCTITE ABLESTIK DX20C

    • Translucent
    • Non conductive
    • For GaN LEDs
  • ABLESTIK 9392

    ABLESTIK 9392

    • Flexible Cured Adhesive
    • 168-Hour 24 deg C Cure
    • 1.00 x 10^13 ohm-cm Volume Resistivity
  • Loctite Ablestik JM7000

    LOCTITE ABLESTIK JM7000

    • Low moisture in cavity
    • Low ionic impurities
    • Minimal voiding
  • LOCTITE ABLESTIK NCA 3280

    LOCTITE ABLESTIK NCA 3280

    • Excellent adhesion
    • Fast cure at low temp
    • Halogen free
  • LOCTITE EC210

    LOCTITE EC210

    • General-Purpose Electrical Insulation Coating
    • 55:35 Two-Part Mixing
    • 55 to 150 deg C Service Range
  • LOCTITE ABLESTIK QMI 516

    LOCTITE ABLESTIK QMI 516

    • Electrically conductive
    • Hydrophobic
    • Snap cure
  • LOCTITE ABLESTIK QMI516IE
    No longer available

    LOCTITE ABLESTIK QMI 516IE

    • Electrically conductive
    • Hydrophobic
    • Snap cure
  • LOCTITE ABLESTIK QMI2569

    LOCTITE ABLESTIK QMI2569

    • Silver glass die attach
    • Excellent adhesion
    • Excellent RGA moisture results
  • LOCTITE ABLESTIK QMI3555

    LOCTITE ABLESTIK QMI3555

    • Wide processing window
    • Silver/Vanagium glass
    • Reworkable at less than 350°C
  • LOCTITE ABLESTIK QMI505MT

    LOCTITE ABLESTIK QMI505MT

    • Electrically conductive
    • Low modulus
    • Skip Cure
  • Loctite Ablestik QMI519

    LOCTITE ABLESTIK QMI519

    • Void free bondline
    • Hydrophobic
    • Strongest Die attach
  • Loctite Ablestik QMI529HT

    LOCTITE ABLESTIK QMI529HT

    • Void free bondline
    • Excellent thermal conductivity
    • Stable at high temperatures
  • Loctite Ablestik QMI529HT-LV

    LOCTITE ABLESTIK QMI529HT-LV

    • Low moisture absorption
    • Low stress
    • Hydrophobic
  • LOCTITE ECCOBOND MC723

    LOCTITE ECCOBOND MC723

    • Ultra low moisture absorption
    • For Flip chip BGA
    • Soon to be discontinued
  • TEROSON 5510

    TEROSON 5510

    • Elastic Modified-Silane Bonding
    • Fast Skin-Over Processing
    • 2 mm Depth of Cure
  • LOCTITE ABLESTIK QMI534

    LOCTITE ABLESTIK QMI534

    • Hydrophobic
    • Void free bondline
    • Excellent interfacial adhesion strength
  • TEROSON MS 5570

    TEROSON MS 5570

    • One-Component Moisture-Cure Polymer
    • Fast Skin-Over Processing
    • Elastic Structural Bonding
  • LOCTITE ABLESTIK QMI536

    LOCTITE ABLESTIK QMI536

    • Bismaleimide resin
    • One component
    • Excellent dielectric properties
  • LOCTITE ABLESTIK 2111

    LOCTITE ABLESTIK 2111

    • Thixotropic Vertical/Overhead Bonding
    • 24 N/mm^2 Aluminum Lap Shear
    • Glass/Metal/Plastic Substrate Compatibility
  • LOCTITE SI 595

    LOCTITE SI 595

    • Non-Slumping Sealant Formulation
    • Adhesion and Flexiblity
    • Non-Flammable Sealing Formulation
  • LOCTITE AA 3381

    LOCTITE AA 3381

    • Fast 365 nm Light Fixturing
    • High-Elongation Glass Joint Sealing
    • Dissimilar Rigid-Substrate Bonding
  • Loctite Ablestik QMI536 HT

    LOCTITE ABLESTIK QMI536 HT

    • Bismaleimide resin
    • Hydrophobic
    • Excellent interfacial adhesive strength
  • ABLESTIK 342-3.5

    ABLESTIK 342-3.5

    • Two-Part Ambient-Cure Processing
    • 5,000 mPa s Application Viscosity
    • 29.0 N/mm^2 Aluminum Lap Shear
  • LOCTITE 363

    LOCTITE 363

    • Low-Viscosity Shallow Potting
    • Rapid 365 nm UV Cure
    • Dielectric Electronic Encapsulation
  • Loctite Ablestik QMI536NB

    LOCTITE ABLESTIK QMI536NB

    • Bismaleimide resin
    • Low stress
    • No-bleed version of QMI536
  • ABLESTIK 45LV

    ABLESTIK 45LV

    • Flexible Cured Adhesive
    • 16,000 to 30,000 mPa s Mixed Viscosity
    • 16 kV/mm Dielectric Strength
  • LOCTITE 3922

    LOCTITE 3922

    • Low-Viscosity Cannula Bonding
    • Fast UV/Visible-Light Fixturing
    • Sterilization-Tested Needle Assemblies
  • LOCTITE ABLESTIK QMI538NB

    LOCTITE ABLESTIK QMI538NB

    • PTFE filled
    • No bleed
    • Lower modulus than QMI536NB
  • ABLESTIK 970-1N1

    ABLESTIK 970-1N1

    • Thixotropic Application Control
    • 20.7 N/mm^2 Aluminum Lap Shear
    • 90-Minute Working Window
  • LOCTITE 3936

    LOCTITE AA 3936

    • Medium-Viscosity Gap Control
    • Sub-Five-Second Light Fixturing
    • Flexible Cannula Bonding
  • LOCTITE ABLESTIK QMI550

    LOCTITE ABLESTIK QMI550

    • Non conductive
    • Hydrophobic
    • Skip Cure
  • ABLESTIK D275

    ABLESTIK D275

    • 31 N/mm^2 Aluminum Lap Shear
    • 60-Minute 100 deg C Cure
    • Semi-Rigid Cured Material
  • LOCTITE 4047

    LOCTITE 4047

    • Rapid Blue-or-UV Photocure
    • High-Viscosity Placement Control
    • Low-Shrink Mechanical Stability
  • LOCTITE ABLESTIK QMI9507-2C2
    No longer available

    LOCTITE ABLESTIK QMI9507-2C2

    • Controlled bondline thickness
    • High thermal conductivity
    • Stable at high temperatures
  • ABLESTIK FDA2

    ABLESTIK FDA 2

    • 1.20 x 10^14 ohm-cm Volume Resistivity
    • 3-Hour Working Window
    • 1,800 psi Aluminum Lap Shear
  • LOCTITE 4310

    LOCTITE 4310

    • Low-Viscosity Dual Cure
    • Rapid Exposed-Surface Fixturing
    • Fluorescent Process Inspection
  • ABLESTIK FDA22

    ABLESTIK FDA 22

    • 1.50 x 10^14 ohm-cm Volume Resistivity
    • 3-Hour Working Window
    • 2,100 psi Aluminum Lap Shear
  • LOCTITE 5056

    LOCTITE 5056

    • Rapid UV Silicone Cure
    • Low-Viscosity Potting and Coating
    • Transparent Elastomeric Final State
  • Loctite Eccobond 931-1T1N1

    LOCTITE ECCOBOND 931-1T1N1

    • Low viscosity
    • Low temperature cure
    • Extraordinary adhesion
  • ABLESTIK FDA2T

    ABLESTIK FDA 2T

    • 1.20 x 10^14 ohm-cm Volume Resistivity
    • 3-Hour Working Window
    • 1,800 psi Aluminum Lap Shear
  • LOCTITE AA 326

    LOCTITE AA 326

    • One-Component Activator Cure
    • Controlled High-Viscosity Placement
    • Ferrite-to-Metal Structural Bonding
  • ABLESTIK GA 47-2LV

    ABLESTIK GA 47-2LV

    • Gyro-Flotation-Fluid-Compatible Instrument Bonding
    • 25 ppm/deg C Linear Thermal Expansion
    • 2-Hour 95 deg C Cure
  • ECCOBOND EO1061

    LOCTITE ECCOBOND EO 1061

    • Extended Pot-Life Processing
    • Stable-Viscosity Dispensing Control
    • One-Part Heat-Cure Encapsulation
  • LOCTITE AA 3341

    LOCTITE AA 3341

    • Low-Viscosity Thermoplastic Bonding
    • Fast UV/Visible-Light Cure
    • Flexible 220% Elongation
  • ABLESTIK SF40

    ABLESTIK SF 40

    • Low-Density Syntactic Foam Adhesive
    • Thixotropic Vertical-Surface Control
    • Room-Temperature Adhesive Cure
  • ECCOBOND FP4546

    ECCOBOND FP4546

    • Low-CTE Flip-Chip Underfill
    • Toughened Crack-Resistant Epoxy
    • 32-Hour Pot Life at 25 deg C
  • LOCTITE AA 3751

    LOCTITE AA 3751

    • Solvent-Free 100% Solids
    • 10-Second UV Fixture
    • Multi-Function UV Processing
  • LOCTITE 7113

    LOCTITE 7113

    • Post-Applied Cyanoacrylate Activation
    • Rapid Solvent Flash-Off
    • 24-Hour On-Part Activity
  • LOCTITE AA 3943

    LOCTITE AA 3943

    • Cannula-Focused Medium-Viscosity Dispensing
    • Sub-5-Second UV Fixture
    • UV-Fluorescent Assembly Inspection
  • LOCTITE 736

    LOCTITE 736

    • Passive-Surface Cure Acceleration
    • Very-Low-Viscosity Surface Wetting
    • 30-Minute On-Part Activity
  • LOCTITE H8000

    LOCTITE H8000

    • Visible 10:1 Mix Confirmation
    • 30-Minute Assembly Window
    • Resilient Peel and Impact Performance
  • LOCTITE HY4080

    LOCTITE HY 4080

    • Equal-Volume Hybrid Mixing
    • 10-Minute Fixture on Metals
    • Tough Peel and Impact Performance
  • LOCTITE EA 2000

    LOCTITE EA 2000

    • Low-VOC Water-Based Nitrile-Phenolic Primer
    • Blue-to-Blue-Green Color Change
    • BMS 5-42 Type 3 Qualification
  • LOCTITE SF770

    LOCTITE SF770

    • Cyanoacrylate Adhesion Primer
    • Low-Surface-Energy Plastic Bonding
    • 8 to 9-Second Dry Time
  • LOCTITE SF7701

    LOCTITE SF7701

    • Low-Energy Plastic Priming
    • Fast 30-Second Drying
    • UV-Visible Primer Inspection
  • ECCOBOND FP0066

    ECCOBOND FP0066

    • Conductive Semiconductor Encapsulation
    • Two-Hour Cure at 60 deg C
    • Firm Shore D 80 Cure
  • STYCAST 1090

    STYCAST 1090

    • Low-Density Aerospace Encapsulation
    • 45-Minute Working Window
    • NASA Outgassing Performance
  • STYCAST 1090SI

    STYCAST 1090SI

    • High Compressive-Stress Potting
    • Low-Density Deep-Ocean Encapsulation
    • 30-Minute Pot Life
  • STYCAST 1217

    STYCAST 1217

    • Low-Viscosity Coil Impregnation
    • Catalyst-Selectable Working Window
    • Clear Inspection-Friendly Encapsulation
  • STYCAST 1265

    STYCAST 1265

    • Soft-Gel Stress-Sensitive Encapsulation
    • Extended 24-Hour Work Life
    • Cuttable Repair Access
  • LOCTITE 9430

    LOCTITE 9430

    • 4,700 psi Lap Shear
    • 50-Minute Working Window
    • Up to 0.1-Inch Gap Bonding
  • STYCAST 1266

    STYCAST 1266

    • Low-Viscosity Fine-Gap Impregnation
    • Optically Clear Encapsulation
    • Flexible Ambient or Heat Cure
  • STYCAST 1495K

    STYCAST 1495K

    • Thermally Conductive Electronic Potting
    • 45-Minute CAT 9 Work Life
    • Transformer and Sensor Encapsulation
  • HYSOL E-40HT

    LOCTITE EA E-40HT

    • Extended-Work-Life Structural Bonding
    • Elevated-Temperature Epoxy Bonding
    • Tough Shear- and Impact-Resistant Bondline
  • STYCAST 2057

    STYCAST 2057

    • Low-Abrasion Meter-Mix Processing
    • Machine-Dispensable Epoxy Encapsulation
    • Post-Molding Machining Capability
  • STYCAST 2651

    STYCAST 2651

    • Catalyst-Selectable Cure Profiles
    • 45-Minute CAT 9 Work Life
    • NASA Outgassing Performance
  • STYCAST 2651-1

    STYCAST 2651-1

    • One-Component Production Handling
    • -40 to 155 deg C Service
    • Thermal-Shock-Resistant Electronic Encapsulation
  • STYCAST 2651-40

    STYCAST 2651-40

  • STYCAST 2651-40FR

    STYCAST 2651-40FR

    • Low-Viscosity Potting Process
    • Flame-Retardant Cured Encapsulation
    • Low-Temperature Operating Range
  • LOCTITE 1C

    LOCTITE EA 1C

    • Multi-Material Metal/Plastic/Wood Bonding
    • Machineable Sandable Cured Epoxy
    • Low-Outgassing Epoxy Adhesive
  • STYCAST 2662

    STYCAST 2662

    • High-Temperature 230 deg C Service
    • Extended 24-Hour Working Window
    • Staged Large-Casting Cure
  • LOCTITE E-00CL

    LOCTITE E-00CL

    • 1:1 Two-Component Epoxy
    • 3.5-Minute Working Life
    • Electrically Insulating Epoxy
  • STYCAST 2741

    STYCAST 2741

    • Catalyst-Adjusted Cured Flexibility
    • Shock- and Impact-Resistant Potting
    • Room-Temperature or Accelerated Cure
  • ECCOBOND F113

    ECCOBOND F113

    • Low-Viscosity Precision Application
    • Optically Clear Material
    • High Surface Wettability
  • LOCTITE E-00NS

    LOCTITE E-00NS

    • Clear Two-Component Epoxy
    • 3.5-Minute Working Life
    • High-Dielectric-Strength Epoxy Adhesive
  • STYCAST 2741LV

    STYCAST 2741LV

    • Lower-Viscosity Electronic Potting
    • Selectable Rigid-to-Flexible Cure
    • Impact-Resistant Multi-Substrate Encapsulation
  • LOCTITE E-04

    LOCTITE E-04

    • Two-Component Adhesive System
    • Thixotropic Application Control
    • Low-Shrinkage Epoxy Bonding
  • LOCTITE E-05MR

    LOCTITE E-05MR

    • Ultra-Clear 1:1 Epoxy
    • Fast Adhesive Fixture
    • 34 kV/mm Dielectric Strength
  • LOCTITE E-214HP

    LOCTITE E-214HP

    • One-Component Adhesive System
    • Heat-Activated Bonding Cure
    • Thermal Shock Resistance
  • LOCTITE E-40FL

    LOCTITE E-40FL

    • Toughened Epoxy Bonding
    • Medium Owrking Life
    • Shock and Vibration Resistance
  • LOCTITE E-60HP

    LOCTITE E-60HP

    • Extended 60-Minute Working Life
    • Toughened Structural Epoxy Bonding
    • Electrical-Insulating Cured Bondline
  • LOCTITE EA 3981

    LOCTITE EA 3981

    • One-Component No-Mix Adhesive
    • Heat Cure as Low as 100 deg C
    • Disposable-Needle/Syringe/Lancet Cannula Bonding
  • LOCTITE EA 445

    LOCTITE EA 445

    • Pre-Measured Two-Component Mixer Cup
    • 2 to 3-Minute Gel Time
    • Drillable, Tappable, Sandable Cured Epoxy
  • LOCTITE EA 608

    LOCTITE EA 608

    • Clear Fast-Setting Structural Epoxy
    • 1:1 Weight/Volume Mixing
    • Metal and Plastic Bonding
  • LOCTITE EA 901NA-B1

    LOCTITE EA 901NA-B1

    • Thixotropic Gap-Filling Control
    • 50-Minute Working Window
    • Room-Temperature Application Cure
  • LOCTITE EA 9309.2

    LOCTITE EA 9309.2

    • 40 lb/in Peel Strength
    • 37.2 MPa Aluminum Lap Shear
    • Moderate-Viscosity Two-Part Paste
  • LOCTITE EA 9309.3

    LOCTITE EA 9309.3

    • Glass-Bead Bondline Control
    • 34.5 MPa Aluminum Lap Shear
    • Lap Shear Was Evaluated After hot/wet
  • LOCTITE EA 9309NA

    LOCTITE EA 9309NA

    • High Peel Strength on Prepared Aluminum
    • Glass, Metal, and Wood Bonding
    • 1-Hour 180 deg F Cure
  • LOCTITE EA 9313

    LOCTITE EA 9313

    • Flexible Cured Adhesive
    • 0.6 to 1.5 Pa s Mixed Viscosity
    • 60-Minute Working Window
  • LOCTITE EA 9323

    LOCTITE EA 9323

    • Low-Viscosity Adhesive Application
    • 30-Minute Working Window
    • 5-Day Cure Cycle
  • LOCTITE EA 9330

    LOCTITE EA 9330

    • High Aluminum Peel and Lap-Shear Strength
    • 60-Minute Working Window
    • Multi-Fluid and Salt-Spray Resistance
  • LOCTITE EA 9330.3

    LOCTITE EA 9330.3

    • Thixotropic Application Control
    • 1-Hour 82 deg C Cure
    • 33.8 MPa Aluminum Lap Shear
  • LOCTITE EA 9359.3

    LOCTITE EA 9359.3

    • 2:1 Controlled Mixing
    • 7-Day Cure Cycle
    • Humidity and Fluid Resistance
  • LOCTITE EA 9394.3

    LOCTITE EA 9394.3

    • 4,200 psi Aluminum Lap Shear
    • 90-Minute Working Window
    • Thixotropic Gap-Filling Control
  • LOCTITE EA 9394C-2

    LOCTITE EA 9394C-2

    • 1-Hour 204 deg C Cure
    • Extended Working Window for Controlled Assembly Operations
    • Qualified to MMM-A-132 Type Ii
  • LOCTITE AA 3921

    LOCTITE AA 3921

    • 5-Second UV/Visible-Light Cure
    • Transparent Cured Bondline
    • High-Hardness Acrylic Adhesive
  • LOCTITE EA 9394S

    LOCTITE EA 9394S

    • 28.9 MPa Aluminum Lap Shear
    • Controlled Two-Part Processing
    • Paste-Form Adhesive Application
  • LOCTITE EA 9396.6MD

    LOCTITE EA 9396.6MD

    • Two-Part Potting/Edge-Fill Syntactic Epoxy
    • Controlled Processing Window
    • Elevated-Temperature Mechanical Properties
  • LOCTITE EA 9396C-2

    LOCTITE EA 9396C-2

    • Extended Processing Window
    • 1-Hour Cure Cycle
    • Non-MDA Curing and Application
  • LOCTITE EA 9460

    LOCTITE EA 9460

    • Impact/Fatigue-Resistant Cured Epoxy
    • 40 to 65-Minute Pot Life
    • Multi-Material Metal/Thermoplastic/Laminate Bonding
  • LOCTITE EA 960F

    LOCTITE EA 960F

    • Aircraft Fairing and Smoothing
    • Controlled Rapid Processing
    • Documented Aluminum Bond Performance
  • LOCTITE EA 9696

    LOCTITE EA 9696

    • High-Toughness Aerospace Bonding
    • Broad Controlled Cure Window
    • 2,000-Hour Environmental Conditioning
  • LOCTITE EA D609

    LOCTITE EA D609

    • 10-Minute Handling Time
    • Self-Leveling Flowable Placement
    • Fuel and Water Resistance
  • LOCTITE EA E-120HP

    LOCTITE EA E-120HP

    • 120-Minute Working Life
    • Peel, Impact, Thermal-Shock, and Chemical Resistance
    • Aerospace and Industrial Bonding
  • LOCTITE EA E-20HP

    LOCTITE EA E-20HP

    • Glass-to-Wood Epoxy Bonding
    • 20-Minute Working Window
    • 20 kV/mm Dielectric Strength
  • LOCTITE ECCOBOND 50300-1
    No longer available

    LOCTITE ECCOBOND 50300-1

    • One component
    • Low CTE
    • Low viscosity
  • LOCTITE EA E-20NS

    LOCTITE EA E-20NS

    • Non-Sag Vertical Bonding
    • Tough High-Peel/Shear Bonding
    • Electrically Insulating Multi-Material Bonding
  • Loctite Eccobond 50300HT

    LOCTITE ECCOBOND 50300HT

    • Low viscosity
    • Low CTE
    • Glob top
  • LOCTITE EA E214HP

    LOCTITE EA E214HP

    • One-Component, No-Mix Epoxy Paste Simplifies Material Preparation
    • 37 N/mm^2 Stainless-Steel Lap Shear
    • 22 kV/mm Dielectric Strength
  • LOCTITE ECCOBOND 50300LT
    No longer available

    LOCTITE ECCOBOND 50300LT

    • High wire profile
    • Less thixotropic
    • Glob top
  • LOCTITE EA E-310

    LOCTITE EA E-310

    • Glass, Metal, and Plastic Bonding
    • 6,000 psi Shear Strength
    • Up to 5.1 mm Gap Filling
  • Loctite Eccobond 50400-1

    LOCTITE ECCOBOND 50400-1

    • Low viscosity
    • Low CTE
    • One component
  • LOCTITE EA M-121HP

    LOCTITE EA M-121HP

    • Non-Sag Placement Control
    • Two-Part, Room-Temperature-Curing System
    • Prepared Metals Bonding
  • LOCTITE ECCOBOND 7010C DAM

    LOCTITE ECCOBOND 7010C DAM

    • Dam
    • Low CTE
    • High purity
  • LOCTITE EA M-31

    LOCTITE EA M-31

    • Ultra-Clear Bonding Material
    • 30-Minute Working Window
    • 19.7 kV/mm Dielectric Strength
  • LOCTITE ECCOBOND 7010C FILL

    LOCTITE ECCOBOND 7010C FIL

    • Fill Encapsulant
    • Low CTE
    • High purity
  • LOCTITE EA0151

    LOCTITE EA 0151

    • Clear, Two-Component Epoxy
    • Sixty-Minute Working Window
    • Room-Temperature Adhesive Cure
  • LOCTITE EA 9306NA

    LOCTITE EA 9306NA

    • One-Component, Heat-Curing Epoxy Paste
    • Low-Exotherm Bonding Processing
    • 34.5 MPa Aluminum Lap Shear
  • LOCTITE ECCOBOND BF4

    LOCTITE ECCOBOND BF4

    • Low moisture
    • High Tg
    • Epoxy backfill material
  • LOCTITE EA 9394

    LOCTITE EA 9394

    • Two-Part Aerospace Structural Epoxy Paste
    • 177 deg C Service Temperature
    • MMM-A-132 Qualified Epoxy
  • LOCTITE ECCOBOND CB064
    No longer available

    LOCTITE ECCOBOND CB064

    • High purity
    • Very low CTE (7 ppm/°C)
    • Also known as FP4653
  • LOCTITE HY4090

    LOCTITE HY 4090

    • Cyanoacrylate/Epoxy Hybrid Adhesive
    • Below 180-Second Fixture Time
    • Steel/Aluminum/Polycarbonate Lap-Shear Bonding
  • LOCTITE ECCOBOND EN 3838T

    LOCTITE ECCOBOND EN 3838T

    • PCB Coating
    • Very Low Tg
    • Fast cure at 130°C
  • LOCTITE M-21HP

    LOCTITE M-21HP

    • Two-Component Adhesive System
    • High Peel Resistance
    • Room-Temperature Curing Epoxy Bonding
  • Loctite Eccobond EO1016

    LOCTITE ECCOBOND EO1016

    • Glob top Encapsulant
    • Smartcard applications
    • Fast curing
  • LOCTITE ECCOBOND EO1062

    LOCTITE ECCOBOND EO1062

    • Low flow
    • Non conductive
    • Excellent reliability
  • LOCTITE ECCOBOND EO1072

    LOCTITE ECCOBOND EO1072

    • High Tg
    • Low ionics
    • Both Dam & Fill
  • Loctite Eccobond EO7021

    LOCTITE ECCOBOND EO7021

    • Fast cure
    • Glob top
    • Die attach & Encapsulant
  • Loctite Eccobond EO7029

    LOCTITE ECCOBOND EO7029

    • Smartcard applications
    • Non conductive
    • Die attach & Encapsulant
  • LOCTITE ECCOBOND FP0087

    LOCTITE ECCOBOND FP0087

    • High Tg
    • Excellent moisture resistance
    • Excellent thermal shock resistance
  • LOCTITE ECCOBOND FP4323

    LOCTITE ECCOBOND FP4323

    • Thixotropic
    • Low CTE
    • High purity
  • Loctite Eccobond FP4450
    No longer available

    LOCTITE ECCOBOND FP4450

    • Fill Encapsulant
    • High purity
    • Good moisture resistance
  • Loctite Eccobond FP4450

    LOCTITE ECCOBOND FP4450HF

    • Excellent corrosion resistance
    • Low filler size
    • Self levelling - Low alpha
  • LOCTITE ECCOBOND FP4451
    No longer available

    LOCTITE ECCOBOND FP4451

    • Encapsulant - DAM
    • High purity
    • Minimal slumping
  • Loctite Eccobond FP4451TD

    LOCTITE ECCOBOND FP4451TD

    • Encapsulant - DAM
    • High purity
    • Exceptional thermal stability
  • Loctite Eccobond FP4460

    LOCTITE ECCOBOND FP4460

    • Improved work life
    • High temperature performance
    • High flow
  • LOCTITE ECCOBOND FP4460

    LOCTITE ECCOBOND FP4470

    • High purity
    • Green product
    • Handles solder reflow temperatures
  • LOCTITE ECCOBOND FP4650

    LOCTITE ECCOBOND FP4650

    • Excellent chemical resistance
    • Low thermal expansion
    • High purity
  • Loctite Eccobond FP4651

    LOCTITE ECCOBOND FP4651

    • Excellent chemical resistance
    • Low thermal expansion
    • Alternative to FP4654
  • LOCTITE ECCOBOND FP4654
    No longer available

    LOCTITE ECCOBOND FP4654

    • High purity
    • Self levelling
    • Low stress
  • LOCTITE ECCOBOND FP4655

    LOCTITE ECCOBOND FP4655

    • Low stress
    • Fine particle filler
    • Combine with FP4451
  • Loctite Eccobond FP4802

    LOCTITE ECCOBOND FP4802

    • High purity
    • Excellent flow
    • Phenolic encapsulant
  • LOCTITE ECCOBOND ME995-1-4
    No longer available

    LOCTITE ECCOBOND ME995-1-4

    • One component
    • Thermally conductive
    • High viscosity
  • LOCTITE ECCOBOND UV8800M
    No longer available

    LOCTITE ECCOBOND UV8800M

    • UV Cure
    • Cures rapidly
    • Excellent adhesion
  • LOCTITE ECCOBOND UV8800M-X
    No longer available

    LOCTITE ECCOBOND UV8800M-X

    • Fast UV Cure
    • Good workability
    • Good adhesion
  • LOCTITE ECCOBOND UV9052

    LOCTITE ECCOBOND UV9052

    • UV & Moisture Cure
    • Cures in shadowed areas
    • No stringing
  • LOCTITE ECCOBOND UV9060F

    LOCTITE ECCOBOND UV9060F

    • UV & Moisture Cure
    • Cures in shadowed areas
    • Translucent light blue
  • LOCTITE SI 5088

    LOCTITE SI 5088

    • Straw colored liquid
    • UV Cure
    • Alkoxy Silicone
  • LOCTITE SI5092

    LOCTITE SI5092

    • Yellow to Green liquid
    • UV Cure
    • Non corrosive
  • LOCTITE STYCAST 2850FT

    LOCTITE STYCAST 2850FT

    • Thermally conductive
    • Low CTE
    • Used with various catalysts
  • LOCTITE STYCAST 2851FT

    LOCTITE STYCAST 2851FT

    • Solvent free
    • 100% solids
    • Low temperature cure
  • LOCTITE STYCAST A316-48

    LOCTITE STYCAST A316-48

    • Non conductive
    • High Tg
    • Fast cure
  • LOCTITE STYCAST E2517

    LOCTITE STYCAST E2517

    • Low CTE
    • Low Viscosity
    • High temperature resistance
  • LOCTITE STYCAST E2534FR

    LOCTITE STYCAST E2534FR

    • Flame retardant
    • Halogen free
    • High thermal conductivity
  • LOCTITE STYCAST OS5101

    LOCTITE STYCAST OS5101

    • UV Cure
    • Optoelectronics assembly
    • Low CTE and moisture absorption
  • LOCTITE STYCAST U2500

    LOCTITE STYCAST U2500

    • Two components
    • Potting component
    • Room temperature cure
  • LOCTITE SI 5293

    LOCTITE SI 5293

    • PCB/Electronics Protection
    • UV and moisture cure
    • Alkoxy Silicone
  • LOCTITE STYCAST PC18M

    LOCTITE STYCAST PC18M

    • Conformal Coating
    • For environmental and moisture protection
    • Room temperature cure
  • LOCTITE STYCAST PC40-UMF

    LOCTITE STYCAST PC40-UMF

    • VOC free
    • Single component
    • UV and Moisture cure
  • LOCTITE STYCAST PC62

    LOCTITE STYCAST PC62

    • Fluorescent under UV
    • Toluene free
    • Easily removable with soldering iron
  • ABLESTIK 216C03

    ABLESTIK 216C03

    • Equal-Weight Mix Control
    • Ambient or Accelerated Cure
    • Flexible Non-Conductive Bonding
  • LOCTITE E-60NC

    LOCTITE E-60NC

    • Two-Component Adhesive System
    • Low-Viscosity Adhesive Application
    • Non-Corrosive Bonding Formulation
  • LOCTITE EA 11C

    LOCTITE EA 11C

    • Machinable, Low-Outgassing Cured Material
    • Bonds Metals, Most Plastics and Wood
    • Room-Temperature or Heat Cure
  • LOCTITE EA 9321

    LOCTITE EA 9321

    • Thixotropic Application Control
    • Room-Temperature Retention Cure
    • 1,000 psi Lap Shear
  • LOCTITE EA 9807

    LOCTITE EA 9807

    • Pourable Intermediate-Density Epoxy Syntactic
    • Room-Temperature or Heat Cure
    • 121 deg C Service Temperature
  • LOCTITE EA 9825

    LOCTITE EA 9825

    • Low-Density, One-Component Epoxy Syntactic
    • Up to 350 deg F Service
    • Honeycomb Composite Potting
  • LOCTITE EA 3942

    LOCTITE EA 3942

    • 900-1,600 mPa s Dispensing
    • Sub-5-Second UV Fixture
    • UV-Fluorescent Assembly Inspection
  • LOCTITE ES6010

    LOCTITE ES6010

    • Low-Viscosity Electronics Potting
    • 80-to-100-Minute Working Time
    • Room-Temperature or Heat Cure
  • LOCTITE EA 3943

    LOCTITE EA 3943

    • Cannula-Focused Medium-Viscosity Dispensing
    • Sub-5-Second UV Fixture
    • UV-Fluorescent Assembly Inspection
  • LOCTITE SI 5210

    LOCTITE SI 5210

    • Ultra-Fast RTV Silicone Cure
    • Non-Corrosive Alkoxy-Cure Potting
    • Thixotropic Non-Sag Application
  • LOCTITE EA 460

    LOCTITE EA 460

    • Low-Odor Low-Bloom Bonding
    • Low-Viscosity Precision Application
    • Rapid Multi-Substrate Fixture
  • LOCTITE EA 7000

    LOCTITE EA 7000

    • Dual-Temperature Composite Cure
    • Extended 30-Day Out Time
    • Supported or Unsupported Film
  • LOCTITE EA 9017

    LOCTITE EA 9017

    • Premeasured Resin-Hardener Pack
    • Fast 4-6-Minute Handling
    • Machinable Cured Epoxy Finish
  • LOCTITE EA 9340

    LOCTITE EA 9340

    • Visual 1:1 Mix Confirmation
    • Extended 90-Minute Pot Life
    • High-Temperature Shear Retention
  • LOCTITE EA 9394.2

    LOCTITE EA 9394.2

    • Thixotropic Gap-Filling Control
    • Fast 4-Hour Set
    • 24-Hour Room-Temperature Cure
  • LOCTITE EA 9658

    LOCTITE EA 9658

    • 177 deg C Nacelle Bonding
    • Extended 15-Day Assembly Window
    • Controlled Flow and Flash
  • LOCTITE EA 9658.060UNS

    LOCTITE EA 9658.060UNS

    • Unsupported 0.060 lb/sf Film
    • 177 deg C Cure Capability
    • Extended 15-Day Assembly Window
  • LOCTITE EA 9658.100

    LOCTITE EA 9658.100

    • Non-Woven Glass Film Support
    • 177 deg C High-Temperature Cure
    • Extended 15-Day Assembly Window
  • LOCTITE EA 9686.060

    LOCTITE EA 9686.060

    • Tough Aerospace Structural Bonding
    • Tough Elevated-Temperature Bonding
    • Metal Composite Honeycomb Assembly
  • LOCTITE EA 9690.060K

    LOCTITE EA 9690.060K

    • High-Peel Structural Bonding
    • Knit-Supported Film Handling
    • Sub-121 deg C Cure
  • LOCTITE EA 9696.030

    LOCTITE EA 9696.030

    • Extended 60-Day Assembly Window
    • 107 to 129 deg C Cure
    • Tough 121 deg C Bonding
  • LOCTITE EA 9814

    LOCTITE EA 9814

    • One-Part Syntactic Processing
    • Low-Density Honeycomb Core Filling
    • Fire-Retardant Compressive Support
  • LOCTITE EA 9845SF

    LOCTITE EA 9845SF

    • Co-Cured Composite Surfacing
    • Paint-Ready Surface Quality
    • Reduced Core Crush and Porosity
  • LOCTITE EA 9845SF.030OST

    LOCTITE EA 9845SF.030OST

    • Controlled .030 OST Surface Layer
    • Co-Cure Composite Integration
    • Paint-Ready Composite Finish
  • LOCTITE EA 9891RP

    LOCTITE EA 9891RP

    • Visual Color-Change Mix Verification
    • Room-Temperature Abradable Seal Repair
    • Abrasion-Resistant Paste Restoration
  • LOCTITE EA 9895

    LOCTITE EA 9895

    • One-Piece Peel-Ply Removal
    • Bond-Ready Surface Without Sanding
    • 177 deg C Prepreg Co-Cure
  • LOCTITE EA E-40EXP

    LOCTITE EA E-40EXP

    • Self-Leveling Horizontal Potting
    • Controlled 2:1 Metered Mixing
    • Room-Temperature Potting Cure
  • LOCTITE EA9690.030NW

    LOCTITE EA9690.030NW

    • High-Peel Structural Bonding
    • Low-Flow Film Placement
    • Thin Non-Woven Film Handling
  • LOCTITE EF557

    LOCTITE EF557

    • Expanding Honeycomb Gap Filling
    • Film-Based Splice Reinforcement
    • Dual-Temperature Cure Flexibility
  • LOCTITE EF562S

    LOCTITE EF562S

    • Non-Asbestos Honeycomb Bonding
    • Roll-or-Sheet Layup Flexibility
    • Expanding Core Reinforcement
  • STYCAST 2760

    STYCAST 2760

    • Vinyl-Wire Potting Adhesion
    • 60-Minute Low-Viscosity Processing
    • Room-Temperature or Heat Cure

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